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Year of Publication 22.06.2021
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Year of Publication 22.06.2021
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COMPOSITE BRIDGE DIE-TO-DIE INTERCONNECTION FOR INTEGRATED CIRCUIT PACKAGE
OOI PING PING, LIM SEOK LING, CHEAH BOK ENG, JENNY SHIO YIN ONG, JACKSON CHUNG PENG KONG
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Year of Publication 17.06.2021
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Year of Publication 09.04.2024
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COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY
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Year of Publication 29.02.2024
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DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP)
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Year of Publication 04.01.2024
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SHIELDING ASSEMBLY FOR SEMICONDUCTOR PACKAGES
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Year of Publication 04.01.2024
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Year of Publication 04.01.2024
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MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling
Year of Publication 20.09.2023
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Year of Publication 20.09.2023
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ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 04.07.2024
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Year of Publication 04.07.2024
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Integrated bridge for die-to-die interconnects
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 04.06.2024
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Year of Publication 04.06.2024
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ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FORMING THEREOF
CHEAH, Bok Eng, ONG, Jenny Shio Yin, RUDRARAJU, Ravindra, KONG, Jackson Chung Peng, LIM, Seok Ling, KASTURI, Vijay
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
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LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
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ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
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EMBEDDED REFERENCE LAYERS FO SEMICONDUCTOR PACKAGE SUBSTRATES
KONG, JACKSON CHUNG PENG, OOI, KOOI CHI, ONG, JENNY SHIO YIN, CHEAH, BOK ENG, LIM, SEOK LING
Year of Publication 27.04.2024
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Year of Publication 27.04.2024
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ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 25.04.2024
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Year of Publication 25.04.2024
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