Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors
Elsherbini, Adel, Liff, Shawna, Swan, Johanna, Jun, Kimin, Tiagaraj, Sathya, Pasdast, Gerald
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding
Achieving excellent electro-optic activity and thermal stability in poled polymers through an expeditious crosslinking process
Shi, Zhengwei, Luo, Jingdong, Huang, Su, Polishak, Brent M, Zhou, Xing-Hua, Liff, Shawna, Younkin, Todd R, Block, Bruce A, Jen, Alex K.-Y
Published in Journal of materials chemistry (01.01.2012)
Published in Journal of materials chemistry (01.01.2012)
Get full text
Journal Article
IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration
Sounart, Thomas, Talukdar, Tushar, Braunisch, Henning, Aleksov, Aleksandar, Jun, Kimin, Elsherbini, Adel, Nordeen, Paul, Rawlings, Brandon, Strong, Veronica, Liff, Shawna, Swan, Johanna
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Enabling Hybrid Bonding on Intel Process
Elsherbini, Adel, Jun, Kimin, Vreeland, Richard, Brezinski, William, Niazi, Haris Khan, Shi, Yi, Yu, Qiang, Qian, Zhiguo, Xu, Jessica, Liff, Shawna, Swan, Johanna, Yao, Jimin, Liu, Pilin, Pelto, Christopher, Rami, Said, Balankutty, Ajay, Fischer, Paul, Turkot, Bob
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Get full text
Conference Proceeding
SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES
Karhade, Omkar, Liff, Shawna, Eid, Feras, Choi, Beomseok, Elsherbini, Adel
Year of Publication 22.02.2024
Get full text
Year of Publication 22.02.2024
Patent