Low dielectric constant LTCC material for 5G and preparation method
YAN JIAN, QU MINGSHAN, TIAN MAOLIN, LEE JAE-YOUNG, NIE RUI, LI FANGJUN, LIAO YUWEN
Year of Publication 09.08.2024
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Year of Publication 09.08.2024
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Semiconductor packaging shell material co-fired with copper electrode
YAN JIAN, TIAN MAOLIN, LEE JAE-YOUNG, NIE RUI, LI FANGJUN, LIN XIAOYUN, LIAO YUWEN
Year of Publication 09.08.2024
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Year of Publication 09.08.2024
Patent