Process optimization to reduce NiSi pipes and NiSi agglomeration on 28nm Nickel silicide LSA ms anneal process
Vijayaragavan, Varadharajan, Fitz, Clemens, Lepper, Marco, Reisdorf, Ralf, Jan, Holub, Van Le, Willis, Jim, Yun Wang, Awdshiew, Michael
Published in 2015 International Symposium on VLSI Technology, Systems and Applications (01.04.2015)
Published in 2015 International Symposium on VLSI Technology, Systems and Applications (01.04.2015)
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Conference Proceeding
SOI-Halbleiterbauelement mit einer Substratdiode mit reduzierter Metallsilizidleckage
Lepper, Marco, Heinrich, Jens, Frohberg, Kai, Baars, Peter, Schlott, Jana, Jakubowski, Frank
Year of Publication 08.07.2021
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Year of Publication 08.07.2021
Patent
Convergence and interaction of BEOL and BE reliability methodology
Rzepka, S., Lepper, M., Bottcher, M., Bauer, R., Weber, S.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
SOI semiconductor device comprising a substrate diode with reduced metal silicide leakage
JAKUBOWSKI FRANK, FROHBERG KAI, LEPPER MARCO, BAARS PETER, SCHLOTT JANA, HEINRICH JENS
Year of Publication 18.03.2014
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Year of Publication 18.03.2014
Patent