by Lanza, Mario, Pey, Kin-Leong, Grasser, Tibor
Published in IEEE transactions on electron devices (01.04.2023)

by Sikder, Bejoy, Lim, Jia Hao, Kumar, Mondol Anik, Padovani, Andrea, Haverty, Michael, Kamal, Uday, Raghavan, Nagarajan, Larcher, Luca, Pey, Kin-Leong, Baten, Md Zunaid
Published in IEEE electron device letters (01.01.2021)

by Zhu, Guojun, Zhou, Xing, Lee, Teck Seng, Ang, Lay Kee, See, Guan Huei, Lin, Shihuan, Chin, Yoke-King, Pey, Kin Leong
Published in IEEE transactions on electron devices (01.05.2009)

by Ranganathan, N., Da Yong Lee, Liu Youhe, Guo-Qiang Lo, Prasad, K., Pey, K. L.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)

by Lanza, Mario, Wong, H.‐S. Philip, Pop, Eric, Ielmini, Daniele, Strukov, Dimitri, Regan, Brian C., Larcher, Luca, Villena, Marco A., Yang, J. Joshua, Goux, Ludovic, Belmonte, Attilio, Yang, Yuchao, Puglisi, Francesco M., Kang, Jinfeng, Magyari‐Köpe, Blanka, Yalon, Eilam, Kenyon, Anthony, Buckwell, Mark, Mehonic, Adnan, Shluger, Alexander, Li, Haitong, Hou, Tuo‐Hung, Hudec, Boris, Akinwande, Deji, Ge, Ruijing, Ambrogio, Stefano, Roldan, Juan B., Miranda, Enrique, Suñe, Jordi, Pey, Kin Leong, Wu, Xing, Raghavan, Nagarajan, Wu, Ernest, Lu, Wei D., Navarro, Gabriele, Zhang, Weidong, Wu, Huaqiang, Li, Runwei, Holleitner, Alexander, Wurstbauer, Ursula, Lemme, Max C., Liu, Ming, Long, Shibing, Liu, Qi, Lv, Hangbing, Padovani, Andrea, Pavan, Paolo, Valov, Ilia, Jing, Xu, Han, Tingting, Zhu, Kaichen, Chen, Shaochuan, Hui, Fei, Shi, Yuanyuan
Published in Advanced electronic materials (01.01.2019)

by Dutta, Ramit, Hamid, Shafin Bin, Lim, Jia Hao, Tan, Joel, Sikder, Bejoy, Raghavan, Nagarajan, Pey, Kin Leong, Baten, Md Zunaid
Published in IEEE transactions on electron devices (01.10.2023)

by Eu Jin Tan, Kin-Leong Pey, Singh, N., Guo-Qiang Lo, Dong Zhi Chi, Yoke King Chin, Keat Mun Hoe, Guangda Cui, Pooi See Lee
Published in IEEE electron device letters (01.10.2008)

by Maruvada, Anirudh, Shubhakar, Kalya, Raghavan, Nagarajan, Pey, Kin Leong, O’Shea, Sean J.
Published in Scientific reports (18.08.2022)

by Tan, Joel, Lim, Jia Hao, Sikder, Bejoy, Baten, Md. Zunaid, Kwon, Jae Hyun, Yamane, Kazutaka, Naik, Vinayak Bharat, Raghavan, Nagarajan, Pey, Kin Leong
Published in IEEE transactions on electron devices (01.01.2023)

by PADOVANI, Andrea, RAGHAVAN, Nagarajan, LARCHER, Luca, KIN LEONG PEY
Published in IEEE electron device letters (01.10.2013)

by Molina, Joel, Torres, Reydezel, Ranjan, Alok, Pey, Kin-Leong
Published in Materials science in semiconductor processing (01.08.2017)

by Xueming Tan, D., Kuang Kian Ong, Kin-Leong Pey, Xincai Wang, Guo-Qiang Lo, Chee Mang Ng, Lap Chan, Hong Yu Zheng
Published in IEEE electron device letters (01.12.2009)

by WENHU LIU, PADOVANI, Andrea, LARCHER, Luca, RAGHAVAN, Nagarajan, KIN LEONG PEY
Published in IEEE electron device letters (01.02.2014)

by Susantyoko, Rahmat Agung, Wang, Xinghui, Sun, Leimeng, Pey, Kin Leong, Fitzgerald, Eugene, Zhang, Qing
Published in Carbon (New York) (01.10.2014)

by Zanotti, Tommaso, Ranjan, Alok, O'Shea, Sean J., Raghavan, Nagarajan, Thamankar, Ramesh, Pey, Kin Leong, Maria Puglisi, Francesco
Published in 2023 IEEE International Integrated Reliability Workshop (IIRW) (08.10.2023)

by Ranjan, Alok, Raghavan, Nagarajan, Holwill, Matthew, Watanabe, Kenji, Taniguchi, Takashi, Novoselov, Kostya S, Pey, Kin Leong, O’Shea, Sean J
Published in ACS applied electronic materials (24.08.2021)

by Raghavan, Nagarajan, Bosman, Michel, Pey, Kin Leong
Published in Microelectronics and reliability (01.09.2014)

by Raghavan, Nagarajan, Xing Wu, Bosman, Michel, Kin Leong Pey
Published in IEEE electron device letters (01.08.2013)

by Raghavan, Nagarajan, Pey, Kin Leong, Liu, Wenhu, Wu, Xing, Li, Xiang, Bosman, Michel
Published in Microelectronic engineering (01.07.2011)

by Susantyoko, Rahmat Agung, Wang, Xinghui, Fan, Yu, Xiao, Qizhen, Fitzgerald, Eugene, Pey, Kin Leong, Zhang, Qing
Published in Thin solid films (02.05.2014)