by Cui Li, Yongping Lei, Jian Lin, Ye Tian
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)

by Lin, Jian, Lei, Yongping, Ma, Ninshu, Guo, Fu
Published in Journal of manufacturing processes (01.08.2020)

by Xu, Hailaing, Guo, Xingye, Lei, Yongping, Lin, Jian, Fu, Hanguang, Xiao, Rongshi, Huang, Ting, Shin, Yung C.
Published in Optics and laser technology (01.11.2019)

by Lin, Jian, Ma, Ninshu, Lei, Yongping, Murakawa, Hidekazu
Published in Journal of materials processing technology (01.05.2017)

by Gu, Jian, Lei, YongPing, Lin, Jian, Fu, HanGuang, Wu, Zhongwei
Published in Journal of electronic materials (01.02.2017)

by Yang, Xiaojun, Hu, Wei, Yan, Xin, Lei, Yongping
Published in Journal of electronic materials (01.04.2015)

by Yang, Penghui, Fu, Hanguang, Nan, Rong, Guo, Xingye, Lin, Jian, Lei, Yongping
Published in Journal of materials engineering and performance (01.04.2019)

by Jian Gu, Yongping Lei, Jian Lin, Hanguang Fu, Zhongwei Wu
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)

by Sun, Shuting, Liu, Yangzhen, Fu, Hanguang, Guo, Xingye, Ma, Shengqiang, Lin, Jian, Guo, Gencai, Lei, Yongping, Wang, Ruzhi
Published in Advanced engineering materials (01.10.2018)

by Wang, Tongju, Lin, Jian, Lei, Yongping, Guo, Xingye, Fu, Hanguang, Zhang, Nan
Published in Vacuum (01.10.2018)

by Nan, Rong, Fu, Hanguang, Ma, Shengqiang, Yang, Penghui, Lin, Jian, Guo, Xingye, Lei, Yongping
Published in International journal of materials research (01.07.2019)

by Cheng, Haiqiang, Fu, Hanguang, Lin, Jian, Lei, Yongping
Published in Materialprüfung (04.01.2018)

by Gu, Jian, Lei, YongPing, Lin, Jian, Fu, HanGuang, Wu, Zhongwei
Published in Journal of electronic materials (01.01.2016)

by Cheng, Haiqiang, Fu, Hanguang, Ma, Shengqiang, Lin, Jian, Lei, Yongping
Published in Materials research express (01.01.2019)

by Ju, Jiang, Fu, Hanguang, Lei, Yongping
Published in Materialprüfung (07.09.2016)

by Ma, Xiaoli, Lin, Jian, Ju, Jiang, Lei, Yongping, Fu, Hanguang
Published in Materialprüfung (15.11.2018)

by Lin, Yinghua, Yao, Jianhua, Lei, Yongping, Fu, Hanguang, Wang, Liang
Published in Optics and lasers in engineering (01.11.2016)

by Xiao, Weimin, Lei, Yongping, Xia, Zhidong, Chen, Xin, Han, Yu, Nie, Jingkai, Huang, Pei
Published in Journal of electronic materials (01.11.2017)

by Lin, Yinghua, Yao, Jianhua, Wang, Liang, Zhang, Qunli, Li, Xueqiao, Lei, Yongping, Fu, Hanguang
Published in Journal of materials engineering and performance (01.04.2018)

by Peng Gao, Jian Lin, Yongping Lei, Guichen Wen
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)