Effect of Mn content on microstructure and properties of wear-resistant bainitic steel
Changle, Zhang, Hanguang, Fu, Shengqiang, Ma, Dawei, Yi, Jian, Lin, Zhenguo, Xing, Yongping, Lei
Published in Materials research express (17.05.2019)
Published in Materials research express (17.05.2019)
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Journal Article
Microstructure and properties of high-Si high-Mn bainitic steel after heat treatment
Changle, Zhang, Hanguang, Fu, Shengqiang, Ma, Jian, Lin, Yongping, Lei
Published in Materials research express (24.07.2019)
Published in Materials research express (24.07.2019)
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Journal Article
Microstructure and Properties of Casting Fe–Cr–B Alloy After Quenching Treatment
Ye, Tian, Hanguang, Fu, Jian, Lin, Xingye, Guo, Yongping, Lei
Published in Transactions of the Indian Institute of Metals (01.07.2019)
Published in Transactions of the Indian Institute of Metals (01.07.2019)
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Journal Article
Investigation of rare earth-doped BiAg high-temperature solders
Shi, Yaowu, Fang, Weiping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.09.2010)
Published in Journal of materials science. Materials in electronics (01.09.2010)
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Journal Article
Correlation Between Tensile Strength and Hardness of Electron Beam Welded TC4-DT Joints
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Journal of materials engineering and performance (01.06.2013)
Published in Journal of materials engineering and performance (01.06.2013)
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Journal Article
Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (18.02.2010)
Published in Journal of alloys and compounds (18.02.2010)
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Journal Article
Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach
Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of alloys and compounds (21.01.2011)
Published in Journal of alloys and compounds (21.01.2011)
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Journal Article
Microstructure and Properties of Cast B-Bearing High Speed Steel
Fu, Hanguang, Ma, Shengqiang, Hou, Jianqiang, Lei, Yongping, Xing, Jiandong
Published in Journal of materials engineering and performance (01.04.2013)
Published in Journal of materials engineering and performance (01.04.2013)
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Journal Article
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, Lei, YongPing
Published in Journal of alloys and compounds (20.03.2009)
Published in Journal of alloys and compounds (20.03.2009)
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Journal Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (2008)
Published in Journal of electronic materials (2008)
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Journal Article
Conference Proceeding
Fracture assessment for electron beam welded damage tolerant Ti-6Al-4V alloy by the FITNET procedure
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Chinese journal of mechanical engineering (01.09.2013)
Published in Chinese journal of mechanical engineering (01.09.2013)
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Journal Article
Creep property of composite solders reinforced by nano-sized particles
Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.04.2008)
Published in Journal of materials science. Materials in electronics (01.04.2008)
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Journal Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Journal Article
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
Li, Bo, Shi, Yaowu, Lei, Yongping, Guo, Fu, Xia, Zhidong, Zong, Bin
Published in Journal of electronic materials (01.03.2005)
Published in Journal of electronic materials (01.03.2005)
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Journal Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.02.2009)
Published in Journal of materials science. Materials in electronics (01.02.2009)
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Journal Article
A study of microstructure and properties of cast Fe-10Cr-1.5B alloy
Zhang, Haibin, Cen, Qihong, Fu, Hanguang, Lei, Yongping, Xing, Jiandong
Published in China foundry (01.05.2014)
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Published in China foundry (01.05.2014)
Journal Article
Limit load solution for electron beam welded joints with single edge weld center crack in tension
Lu, Wei, Shi, Yaowu, Li, Xiaoyan, Lei, Yongping
Published in Chinese journal of mechanical engineering (01.05.2012)
Published in Chinese journal of mechanical engineering (01.05.2012)
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Journal Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding