Selective growth of double-walled carbon nanotubes on gold films
Fu, Yifeng, Chen, Si, Bielecki, Johan, Matic, Aleksandar, Wang, Teng, Ye, Li-Lei, Liu, Johan
Published in Materials letters (01.04.2012)
Published in Materials letters (01.04.2012)
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Journal Article
Surface oxide analysis of lead-free solder particles
Luo, Xin, Du, Wenhui, Lu, Xiuzhen, Yamaguchi, Toshikazu, Jackson, Gavin, lei Ye, Li, Liu, Johan
Published in Soldering & surface mount technology (01.01.2013)
Published in Soldering & surface mount technology (01.01.2013)
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Journal Article
Characterization of CNT Enhanced Conductive Adhesives in Terms of Thermal Conductivity
Zhang, Zhfei, Ye, Li-Lei, Kukovecz, Akos, Konya, Zoltan, Bielecki, Johan, Liu, Johan
Published in ECS Transactions (01.01.2012)
Published in ECS Transactions (01.01.2012)
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Journal Article
Conference Proceeding
Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
Falat, Tomasz, Platek, Bartosz, Matkowski, Przemyslaw, Felba, Jan, Zanden, Carl, Li-lei Ye, Liu, Johan
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Polymer nanofiber based continuous metal phase composite for thermal management applications
Carlberg, B, Liu, J, Li-Lei Ye
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Investigation of accelerated surface oxidation of Sn-3.5Ag-0.5Cu solder particles by TEM and STEM
Xin Luo, Wenhui Du, Xiuzhen Lu, Yamaguchi, T., Gavin, J., Li Lei Ye, Liu, J.
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
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Conference Proceeding
Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
Jiang, Di, Wang, Teng, Ye, Li-Lei, Jeppson, Kjell, Liu, Johan
Published in ECS Transactions (01.01.2012)
Published in ECS Transactions (01.01.2012)
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Journal Article
Conference Proceeding
Improved S Surface Controller and Semi-physical Simulation for AUV
Lü, Chong, Pang, Yong-jie, Li, Ye, Zhang, Lei
Published in Journal of marine science and application (01.09.2010)
Published in Journal of marine science and application (01.09.2010)
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Journal Article
TLR4 is required for the obesity-induced pancreatic beta cell dysfunction
Li, Juan, Chen, Lei, Zhang, Ye, Zhang, Weiping J, Xu, Wenyan, Qin, Yi, Xu, Jin, Zou, Dajin
Published in Acta biochimica et biophysica Sinica (01.12.2013)
Published in Acta biochimica et biophysica Sinica (01.12.2013)
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Journal Article
Heritable expansion of the genetic code in mouse and zebrafish
Chen, Yuting, Ma, Ji, Lu, Wenqing, Tian, Meilin, Thauvin, Marion, Yuan, Chonggang, Volovitch, Michel, Wang, Qian, Holst, Jeff, Liu, Mingyao, Vriz, Sophie, Ye, Shixin, Wang, Lei, Li, Dali
Published in Cell research (01.02.2017)
Published in Cell research (01.02.2017)
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Journal Article
Research Progress on Dental Age Estimation Based on MRI Technology
Shi, Lei, Xue, Ye, Qiu, Li-Rong, Lu, Ting, Fan, Fei, Zhou, Yu-Chi, Deng, Zhen-Hua
Published in Fa yi xue za zhi (25.04.2024)
Published in Fa yi xue za zhi (25.04.2024)
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Journal Article
Intraoperative high-field magnetic resonance imaging, multimodal neuronavigation, and intraoperative electrophysiological monitoring-guided surgery for treating supratentorial cavernomas
Li, Fang-ye, Chen, Xiao-lei, Xu, Bai-nan
Published in Chronic diseases and translational medicine (01.09.2016)
Published in Chronic diseases and translational medicine (01.09.2016)
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Journal Article
Investigation on interaction between indium based thermal interface material and copper and silicon substrates
Falat, Tomasz, Matkowski, Przemyslaw, Platek, Bartosz, Zanden, Carl, Felba, Jan, Li-Lei Ye, Liu, Johan
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding