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Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
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Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors
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Conference Proceeding
Method to accommodate increase in volume expansion during solder reflow
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Year of Publication 27.04.2010
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Year of Publication 27.04.2010
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Method to accommodate increase in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 27.04.2010
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Year of Publication 27.04.2010
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Break-Dancing Neck
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Published in The New England journal of medicine (17.01.1985)
Published in The New England journal of medicine (17.01.1985)
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Structure to accommodate increase in volume expansion during solder reflow
CALETKA DAVID V, HENDERSON DONALD W, LEHMAN LAWRENCE P, DARBHA KRISHNA, THIEL GEORGE H
Year of Publication 21.09.2006
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Year of Publication 21.09.2006
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Method of accommodating in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 08.08.2006
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Year of Publication 08.08.2006
Patent
Method of accommodating in volume expansion during solder reflow
Caletka, David Vincent, Darbha, Krishna, Henderson, Donald W, Lehman, Lawrence P, Thiel, George Henry
Year of Publication 08.08.2006
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Year of Publication 08.08.2006
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Negative volume expansion lead-free electrical connection
CALETKA, DAVID V, DARBHA, KRISHNA, LEHMAN, LAWRENCE P, THIEL, GEORGE H, HENDERSON, DONALD W
Year of Publication 11.05.2005
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Year of Publication 11.05.2005
Patent
NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
LEHMAN, LAWRENCE, P, THIEL, GEORGE, H, DARBHA, KRISHNA, HENDERSON, DONALD, W, CALETKA, DAVID, V
Year of Publication 12.04.2005
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Year of Publication 12.04.2005
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Structure to accommodate increase in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 23.09.2004
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Year of Publication 23.09.2004
Patent
NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
DAVID, V. CALETKA, GEORGE, H. THIEL, DONALD, W. HENDERSON, LAWRENCE, P. LEHMAN, KRISHNA DARBHA
Year of Publication 11.03.2004
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Year of Publication 11.03.2004
Patent
NEGATIVE VOLUME EXPANSION LEAD-FREE ELECTRICAL CONNECTION
LEHMAN, LAWRENCE, P, THIEL, GEORGE, H, DARBHA, KRISHNA, HENDERSON, DONALD, W, CALETKA, DAVID, V
Year of Publication 04.03.2004
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Year of Publication 04.03.2004
Patent
Structure to accommodate increase in volume expansion during solder reflow
HENDERSON DONALD W, THIEL GEORGE HENRY, LEHMAN LAWRENCE P, DARBHA KRISHNA, CALETKA DAVID VINCENT
Year of Publication 03.02.2004
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Year of Publication 03.02.2004
Patent