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Year of Publication 19.11.2021
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Year of Publication 19.11.2021
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In-situ CMP copper endpoint control system
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Published in 2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) (2001)
Published in 2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) (2001)
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Conference Proceeding
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
SHINAGAWA ROBERT, LEHMAN KURT, TRIKAS THANASSIS, ALLEN RONALD L, BEVIS CHRISTOPHER F, CHEN CHARLES, CHEN HAIGUANG, SETHURAMAN ANANTHA, MENG CHING LING
Year of Publication 09.09.2014
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Year of Publication 09.09.2014
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IN-SITU METALIZATION MONITORING USING EDDY CURRENT MEASUREMENT OR OPTICAL MEASUREMENT
FIELDEN JOHN, ZHAO GUOHENG, JOHNSON WALT, LEHMAN KURT R, NIKOONAHAD MEHRDAD, LEE SHING M
Year of Publication 25.08.2011
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Year of Publication 25.08.2011
Patent