Late-season corn stalk nitrate measurements across the US Midwest from 2006 to 2018
Laurent, Anabelle, Cleveringa, Alex, Fey, Suzanne, Kyveryga, Peter, Wiese, Nathan, Lefebvre, Mark, Newville, Darren, Quinn, Daniel, McGuire, John, Tao, Haiying, Morris, Thomas F., Miguez, Fernando E.
Published in Scientific data (07.04.2023)
Published in Scientific data (07.04.2023)
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Modification of carbon supported catalysts to improve performance in gas diffusion electrodes
Jia, Nengyou, Martin, Rex B, Qi, Zhigang, Lefebvre, Mark C, Pickup, Peter G
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Published in Electrochimica acta (31.05.2001)
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Electron and proton transport in gas diffusion electrodes containing electronically conductive proton-exchange polymers
Qi, Zhigang, C. Lefebvre, Mark, G. Pickup, Peter
Published in Journal of electroanalytical chemistry (1992) (23.11.1998)
Published in Journal of electroanalytical chemistry (1992) (23.11.1998)
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Conference Proceeding
Copper electroplating technology for microvia filling
Lefebvre, Mark, Allardyce, George, Seita, Masaru, Tsuchida, Hideki, Kusaka, Masaru, Hayashi, Shinjiro
Published in Circuit world (01.06.2003)
Published in Circuit world (01.06.2003)
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Enabling Low-Temperature Bonding in Advanced Packaging Using Electrodeposited Indium
Yi Qin, Flajslik, Kristen, Sherzer, Brandon, Banelis, Emily, Inho Lee, Cho, Regina, Grippo, Louis, Imanari, Masaaki, Lefebvre, Mark, Lingyun Wei, Tachikawa, Wataru, Jianwei Dong, Calvert, Jeffrey
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
ELECTROPLATING METHOD OF PHOTORESIST DEFINED FEATURE FROM ELECTRO COPPER PLATING BATH CONTAINING REACTION PRODUCT OF IMIDAZOLE AND BISEPOXIDE COMPOUND
JULIA WOERTINK, YI QIN, MATTHEW THORSETH, JOANNA DZIEWISZEK, ERIC REDDINGTON, LEFEBVRE MARK, ZUHRA NIAZIMBETOVA
Year of Publication 16.02.2017
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Year of Publication 16.02.2017
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ELECTROPLATING METHOD OF PHOTORESIST DEFINED FEATURE FROM ELECTRO COPPER PLATING BATH CONTAINING REACTION PRODUCT OF PYRIDYLALKYL AMINE AND BISEPOXIDE
JULIA WOERTINK, YI QIN, MATTHEW THORSETH, JOANNA DZIEWISZEK, ERIC REDDINGTON, LEFEBVRE MARK, ZUHRA NIAZIMBETOVA
Year of Publication 16.02.2017
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Year of Publication 16.02.2017
Patent
ELECTROPLATING METHOD OF PHOTORESIST DEFINED FEATURE FROM ELECTRO COPPER PLATING BATH CONTAINING REACTION PRODUCT OF IMIDAZOLE COMPOUND, BISEPOXIDE AND HALO BENZYL COMPOUND
JULIA WOERTINK, YI QIN, JULIA KOZHUKH, MATTHEW THORSETH, ERIC REDDINGTON, LEFEBVRE MARK, ZUHRA NIAZIMBETOVA
Year of Publication 16.02.2017
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Year of Publication 16.02.2017
Patent
ELECTROPLATING METHOD OF PHOTORESIST DEFINED FEATURE FROM ELECTRO COPPER PLATING BATH CONTAINING REACTION PRODUCT OF ALPHA AMINO ACID AND BISEPOXIDE
JULIA WOERTINK, YI QIN, MATTHEW THORSETH, JOANNA DZIEWISZEK, ERIC REDDINGTON, LEFEBVRE MARK, ZUHRA NIAZIMBETOVA
Year of Publication 16.02.2017
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Year of Publication 16.02.2017
Patent
Low Stress and High Ductility Copper Electroplating Additive Development
Wei, Lingyun, Kao, Yu Hua, Hazebrouck, Rebecca, Corona, Robert, Lieb, Bryan, Wang, Ying, Lowe, Michael A., Lefebvre, Mark, Pyo, Sung-Ho, Tachikawa, Wataru, Calvert, Jeffrey
Published in ECS transactions (10.09.2015)
Published in ECS transactions (10.09.2015)
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Journal Article
PLATING METHOD
GOMEZ LUIS A, SCALISI MARK A, LIEB BRYAN, HAZEBROUCK REBECCA LEA, THORSETH MATTHEW A, LEFEBVRE MARK
Year of Publication 07.01.2016
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Year of Publication 07.01.2016
Patent