Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
NIAZIMBETOVA, ZUHRA, QIN, YI, REDDINGTON, ERIK, THORSETH, MATTHEW, WOERTINK, JULIA, DZIEWISZEK, JOANNA, LEFEBVRE, MARK
Year of Publication 01.05.2017
Get full text
Year of Publication 01.05.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
NIAZIMBETOVA, ZUHRA, QIN, YI, REDDINGTON, ERIK, KOZHUKH, JULIA, THORSETH, MATTHEW, WOERTINK, JULIA, LEFEBVRE, MARK
Year of Publication 01.04.2017
Get full text
Year of Publication 01.04.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
REDDINGTON ERIK, QIN YI, THORSETH MATTHEW, DZIEWISZEK JOANNA, NIAZIMBETOVA ZUHRA, WOERTINK JULIA, LEFEBVRE MARK
Year of Publication 22.02.2017
Get full text
Year of Publication 22.02.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
KOZHUKH JULIA, REDDINGTON ERIK, QIN YI, THORSETH MATTHEW, NIAZIMBETOVA ZUHRA, WOERTINK JULIA, LEFEBVRE MARK
Year of Publication 22.02.2017
Get full text
Year of Publication 22.02.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths
REDDINGTON ERIK, QIN YI, THORSETH MATTHEW, DZIEWISZEK JOANNA, NIAZIMBETOVA ZUHRA, WOERTINK JULIA, LEFEBVRE MARK
Year of Publication 22.02.2017
Get full text
Year of Publication 22.02.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
QIN, YI, REDDINGTON, ERIK, NIAZIMBETOVA, ZUKHRA, DZIEWISZEK, JOANNA, WOERTINK, JULIA, THORSETH, MATTHEW, LEFEBVRE, MARK
Year of Publication 22.02.2017
Get full text
Year of Publication 22.02.2017
Patent
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
NIAZIMBETOVA, ZUHRA, QIN, YI, REDDINGTON, ERIK, THORSETH, MATTHEW, WOERTINK, JULIA, DZIEWISZEK, JOANNA, LEFEBVRE, MARK
Year of Publication 16.02.2017
Get full text
Year of Publication 16.02.2017
Patent
Plating method
THORSETH, MATTHEW A, GOMEZ, LUIS A, SCALISI, MARK A, HAZEBROUCK, REBECCA LEA, LIEB, BRYAN, LEFEBVRE, MARK
Year of Publication 11.11.2016
Get full text
Year of Publication 11.11.2016
Patent
Optical article
GOELA JITENDRA S, PICKERING MICHAEL A, TRIBA JAMIE L, BROWN NEIL D, CHIRAFISI ANGELO, LEFEBVRE MARK
Year of Publication 08.07.2010
Get full text
Year of Publication 08.07.2010
Patent
Studies of microvia filling mechanism and a novel Cu plating formula
Wei-Ping Dow, Ming-Yao Yen, Lefebvre, M.J.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Get full text
Conference Proceeding
Plating method
THORSETH, MATTHEW A, GOMEZ, LUIS A, SCALISI, MARK A, HAZEBROUCK, REBECCA LEA, LIEB, BRYAN, LEFEBVRE, MARK
Year of Publication 01.04.2016
Get full text
Year of Publication 01.04.2016
Patent
Optical article
GOELA JITENDRA S, PICKERING MICHAEL A, TRIBA JAMIE L, BROWN NEIL D, CHIRAFISI ANGELO, LEFEBVRE MARK
Year of Publication 23.07.2009
Get full text
Year of Publication 23.07.2009
Patent