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Package and method for integration of heterogeneous integrated circuits
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Apparatus and package structure of optical chip
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Year of Publication 25.10.2016
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Package and method for integration of heterogeneous integrated circuits
Kuo Ying-Hao, Lai Jui Hsieh, Huang Tien-Yu, Lee Wan-Yu, Tseng Chun-Hao, Yee Kuo-Chung
Year of Publication 16.08.2016
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Year of Publication 16.08.2016
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