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Factors related to sharps injuries among students in a dental laboratory

Factors related to sharps injuries among students in a dental laboratory

by Cheng, Hsing-Chung, Lee, Shuang-An, Chen, Li-Sheng
Published in Journal of Oral Science (2022)

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Journal Article

Severe unilateral scissors-bite with a constricted mandibular arch: Bite turbos and extra-alveolar bone screws in the infrazygomatic crests and mandibular buccal shelf

Severe unilateral scissors-bite with a constricted mandibular arch: Bite turbos and extra-alveolar bone screws in the infrazygomatic crests and mandibular buccal shelf

by Lee, Shuang-An, Chang, Chris C.H., Roberts, W. Eugene
Published in American journal of orthodontics and dentofacial orthopedics (01.10.2018)

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Journal Article

Factors related to sharps injuries among students in a dental laboratory

Factors related to sharps injuries among students in a dental laboratory

by Cheng, Hsing-Chung, Lee, Shuang-An, Chen, Li-Sheng
Published in Journal of Oral Science (2022)

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Journal Article

Network audio testing system and network audio testing method thereof

Network audio testing system and network audio testing method thereof

by LEE SHUANG-AN, YANG CHIH-KAI
Year of Publication 18.03.2014

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Patent

NETWORK AUDIO TESTING SYSTEM AND NETWORK AUDIO TESTING METHOD THEREOF

NETWORK AUDIO TESTING SYSTEM AND NETWORK AUDIO TESTING METHOD THEREOF

by LEE SHUANG-AN, YANG CHIH-KAI
Year of Publication 06.02.2014

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Patent

Network audio testing system and network audio testing method thereof

Network audio testing system and network audio testing method thereof

by LEE, SHUANG AN, YANG, CHIH KAI
Year of Publication 01.11.2014

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Patent

Network audio testing system and network audio testing method thereof

Network audio testing system and network audio testing method thereof

by YANG, CHIH-KAI, LEE, SHUANG-AN
Year of Publication 01.02.2014

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Patent

Contact clip for semiconductor device package

Contact clip for semiconductor device package

by QIU MEIFEN, YAO YIMING, WANG LEE SHUANG
Year of Publication 20.05.2022

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Patent

SEMICONDUCTOR PACKAGE AND METHOD FOR SENSING CURRENT

SEMICONDUCTOR PACKAGE AND METHOD FOR SENSING CURRENT

by TECK SIM LEE, GAN TAI KI, WANG LEE SHUANG
Year of Publication 08.04.2022

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Patent

Package with low warpage carrier

Package with low warpage carrier

by CELORIO, EMILIANO, J., B, MAUS, IMRE, LIU, STEPHEN, T, MOHAMMED ABDUL RAHMAN, WANG LEE SHUANG, JEONG CHAN YOUNG
Year of Publication 28.06.2024

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Patent

LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES

LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES

by GAN THAI KEE, JOANNA CHYE JO EAN, WANG LEE SHUANG
Year of Publication 05.01.2021

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Patent

Package with electrically insulating carrier and at least one step on encapsulation material

Package with electrically insulating carrier and at least one step on encapsulation material

by FONG CHII SHING, TECK SIM LEE, FUERGUT EDWARD, SCHMOELZER BERND, DUAN KEYAN, WANG LEE SHUANG
Year of Publication 27.05.2022

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Patent

Package and lead frame design for enhanced creepage and clearance

Package and lead frame design for enhanced creepage and clearance

by GAN THAI KEE, FUERGUT EDWARD, LEE TECK-SIM, WANG LEE SHUANG
Year of Publication 17.12.2021

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Patent

Semiconductor package including package body formed with recess

Semiconductor package including package body formed with recess

by QIU MEIFEN, FONG CHII SHING, DAREYEW YEVGENIY BORISOVICH, OTREMBA RALF, FUERGUT EDWARD, SCHMOELZER BERND, ZHANG LIFANG, WANG LEE SHUANG, QASEM AHMAD, CHEN YUNXIAN
Year of Publication 19.09.2023

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Patent

Wire Bonded Package with Single Piece Exposed Heat Slug and Leads

Wire Bonded Package with Single Piece Exposed Heat Slug and Leads

by CABATBAT EDMUND SALES, HONG CHII SHANG, WANG LEE SHUANG
Year of Publication 26.11.2019

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Patent

Multi-chip package

Multi-chip package

by ZULKIFLI MOHD HASRUL, LEE TECK-SIM, OTEMBRA RALF, WANG LEE SHUANG
Year of Publication 05.03.2021

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Patent

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

by ZULKIFLI MOHD HASRUL, WANG LEE-SHUANG, SCHLOEGEL XAVER, LEE TECK-SIM, OTEMBRA RALF, SCHIESS KLAUS
Year of Publication 15.01.2021

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Patent

Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip

by JOANNA CHYE JO EAN, HONG CHII SHANG, WANG WEISHAN, TEAN KE YAN, LEE TECK-SIM, OTEMBRA RALF, WANG LEE SHUANG, LIT HUI KIN
Year of Publication 08.06.2021

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Patent

Package Lead Design with Grooves for Improved Dambar Separation

Package Lead Design with Grooves for Improved Dambar Separation

by CHONG MENG HOW, TAN KAI YANG, NARAYANASAMY JAYAGANASAN, LAM CHEE MING, MURUGAN SANJAY KUMAR, NAVARETNASINGGAM ARIVINDRAN, WANG LEE SHUANG, HOLGADO ELMER SENORIN
Year of Publication 12.01.2021

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Patent

Semiconductor device, assembly method thereof, and power device

Semiconductor device, assembly method thereof, and power device

by TECK SIM LEE, CHOOI MEI CHONG, THOMAS STOEK, AMIRUL AFIQ HUD, WEI HING TAN, STEFAN MACHEINER, LEE SHUANG WANG
Year of Publication 09.10.2018

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Patent