Shape optimization of a fan-shaped hole to enhance film-cooling effectiveness
Lee, Ki-Don, Kim, Kwang-Yong
Published in International journal of heat and mass transfer (01.07.2010)
Published in International journal of heat and mass transfer (01.07.2010)
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Journal Article
Surrogate based optimization of a laidback fan-shaped hole for film-cooling
Lee, Ki-Don, Kim, Kwang-Yong
Published in The International journal of heat and fluid flow (01.02.2011)
Published in The International journal of heat and fluid flow (01.02.2011)
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Journal Article
Polarity Dependency of MOL-TDDB in FinFET
Sharma, Manisha, Park, Hokyung, Zhao, Yinghong, Lee, Ki-Don, Chen, Liangshan, Yoon, Joonah, Ranjan, Rakesh, Kwon, Caleb Dongkyan, Shim, Hyewon, Yeo, Myung Soo, Chung, Shinyoung, Haefner, Jon
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Impacts of Post-Cu CMP Queue Time on Reliability
Zhao, Yinghong, Park, Hokyung, Lee, Ki-Don, Chen, Liangshan, Sharma, Manisha, Huandra, Sugento, Mao, Hanson, Smith, Brian Filemyr, Xia, Wei, Yoon, Joonah, Kim, Junehwan, Yeo, Myung Soo, Chung, Shinyoung, Kim, Ju Kwang
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
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Conference Proceeding
A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation
Ranjan, Rakesh, Perepa, Pavitra R., Lee, Ki-Don, Jha, Ashish K., Sahoo, Kartika C., Sanders, Kayla N., Moeller, Robert, Sharma, Prateek, Kang, Minhyo, Kim, Peter, Song, Kwanjae, Jeon, Yongwoo, Kim, Seungho, Shim, Hyewon, Chung, Shinyoung, Kim, Ju Kwang
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
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Conference Proceeding
Impact of Barrier Metal Thickness on SRAM Reliability
Ranjan, Rakesh, Perepa, Pavitra Ramadevi, Lee, Ki-Don, Park, Hokyung, Kim, Peter, Yerubandi, Ganesh Chakravarthy, Haefner, Jon, Kwon, Caleb Dongkyun, Jin, Min-Jung, Zhou, Wenhao, Shim, Hyewon, Chung, Shinyoung
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Optimization of a Cylindrical Film Cooling Hole using Surrogate Modeling
Lee, Ki-Don, Kim, Kwang-Yong
Published in Numerical heat transfer. Part A, Applications (18.02.2009)
Published in Numerical heat transfer. Part A, Applications (18.02.2009)
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Journal Article
Electromigration reliability issues in dual-damascene Cu interconnections
Ogawa, E.T., Ki-Don Lee, Blaschke, V.A., Ho, P.S.
Published in IEEE transactions on reliability (01.12.2002)
Published in IEEE transactions on reliability (01.12.2002)
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Journal Article
Effect of Joule Heating on electromigration in dual-damascene copper low-k interconnects
Ki-Don Lee, Jinseok Kim, Tae-Young Jeong, Yinghong Zhao, Quan Yuan, Patel, Anuj, Mai, Zack T., Brown, Logan H., English, Steven, Sawyer, Daniel
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
Moisture impact on dielectric reliability in low-k dielectric materials
Ki-Don Lee, Quan Yuan, Patel, Anuj, Zack Tran Mai, Brown, Logan H., English, Steven
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
Published in 2016 IEEE International Reliability Physics Symposium (IRPS) (01.04.2016)
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Conference Proceeding
Film Cooling Performance of Cylindrical Holes Embedded in a Transverse Trench
Lee, Ki-Don, Kim, Kwang-Yong
Published in Numerical heat transfer. Part A, Applications (01.02.2014)
Published in Numerical heat transfer. Part A, Applications (01.02.2014)
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Journal Article
Optimization of ejection angles of double-jet film-cooling holes using RBNN model
Lee, Ki-Don, Choi, Dae-Woong, Kim, Kwang-Yong
Published in International journal of thermal sciences (01.11.2013)
Published in International journal of thermal sciences (01.11.2013)
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Journal Article
Reverse Body Bias Dependence of HCI Reliability in Advanced FinFET
Mahmud, Md Iqbal, Ranjan, Rakesh, Lee, Ki-Don, Perepa, Pavitra Ramadevi, Dongkyun Kwon, Caleb, Choo, Seungjin, Choi, Kihyun
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Polarity Dependence and Metal Density Impact on Multi-Layer Inter-Level TDDB for High Voltage Application
Zhao, Yinghong, Lee, Ki-Don, Sharma, Manisha, Yoon, Joonah, Ranjan, Rakesh, Mahmud, Iqbal, Kwon, Caleb Dongkyan, Soo Yeo, Myung
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Objective function proposed for optimization of convective heat transfer devices
Lee, Ki-Don, Kim, Kwang-Yong
Published in International journal of heat and mass transfer (01.05.2012)
Published in International journal of heat and mass transfer (01.05.2012)
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Journal Article