Search Results - "LEE KEVIN J" :: K.UTB vyhledávací portál

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THROUGH-BODY VIA FORMATION TECHNIQUES

by LEE, Kevin, J
Year of Publication 22.11.2017

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Patent

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Establishment of neuronal connectivity during development of the Drosophila larval visual system

by Campos, A R, Lee, K J, Steller, H
Published in Journal of neurobiology (01.11.1995)

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Journal Article

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INTEGRATED CIRCUIT DIE HAVING BACKSIDE PASSIVE COMPONENTS AND METHODS ASSOCIATED THEREWITH

by LEE Kevin J
Year of Publication 31.08.2017

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Patent

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INTEGRATED CIRCUIT DIE HAVING BACKSIDE PASSIVE COMPONENTS AND METHODS ASSOCIATED THEREWITH

by LEE, Kevin J
Year of Publication 02.08.2017

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Patent

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DAMASCENE-BASED APPROACHES FOR EMBEDDING SPIN HALL MTJ DEVICES INTO A LOGIC PROCESSOR AND THE RESULTING STRUCTURES

by LEE, Kevin J, WANG, Yih
Year of Publication 10.01.2019

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Patent

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APPROACHES FOR EMBEDDING SPIN HALL MTJ DEVICES INTO A LOGIC PROCESSOR AND THE RESULTING STRUCTURES

by LEE, Kevin J, WANG, Yih
Year of Publication 03.01.2019

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Patent

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THROUGH-BODY VIA FORMATION TECHNIQUES

by LEE, Kevin, J
Year of Publication 01.02.2017

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Patent

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THROUGH-BODY VIA FORMATION TECHNIQUES

by LEE KEVIN J
Year of Publication 12.01.2017

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Patent

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Mehrschichtige Dickmetallisierungsstruktur für ein mikroelektronische Einrichtung, integrierte Schaltung, die diese beinhaltet, und Verfahren zum Herstellen einer integrierten Schaltung, die diese beeinhaltet

by Lee, Kevin J
Year of Publication 09.09.2021

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Patent

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INTEGRATED CIRCUIT DIE HAVING BACKSIDE PASSIVE COMPONENTS AND METHODS ASSOCIATED THEREWITH

by LEE, KEVIN J
Year of Publication 31.03.2016

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Patent

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Method for handling very thin device wafers

by LEE KEVIN J
Year of Publication 02.02.2016

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Patent

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DAMASCENE-BASED APPROACHES FOR EMBEDDING SPIN HALL MTJ DEVICES INTO A LOGIC PROCESSOR AND THE RESULTING STRUCTURES

by LEE, Kevin, J, WANG, Yih
Year of Publication 21.09.2017

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Patent

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APPROACHES FOR EMBEDDING SPIN HALL MTJ DEVICES INTO A LOGIC PROCESSOR AND THE RESULTING STRUCTURES

by LEE, Kevin J, WANG, Yih
Year of Publication 14.09.2017

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Patent

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THROUGH-BODY VIA FORMATION TECHNIQUES

by LEE, KEVIN, J
Year of Publication 01.10.2015

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Patent

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METHOD FOR HANDLING VERY THIN DEVICE WAFERS

by LEE, KEVIN, J
Year of Publication 29.07.2015

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Patent

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METHOD FOR HANDLING VERY THIN DEVICE WAFERS

by LEE KEVIN J
Year of Publication 11.06.2015

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Patent

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LOGIC CHIP INCLUDING EMBEDDED MAGNETIC TUNNEL JUNCTIONS

by STEIGERWALD, Joseph M, LEE, Kevin J, EPPLE, John H, GHANI, Tahir, WANG, Yih
Year of Publication 08.08.2022

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Patent

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HIGH DENSITY MEMORY ARRAY WITH SELF-ALIGNED VIA

by LEE, Kevin J, WANG, Yih
Year of Publication 30.03.2017

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Patent

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MEMORY WITH HIGH OVERLAY TOLERANCE

by LEE, Kevin J, WANG, Yih
Year of Publication 30.03.2017

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Structure having a planar bonding surface

by LEE KEVIN J
Year of Publication 31.03.2015

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Patent

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