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"LEE JUIUNG"
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"LEE JUIUNG"
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Circuit board and method of fabricating the same
by
HU, PEII
,
LIN, CHI-WEN
,
LEE
,
JUIUNG
Year of Publication
11.05.2022
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Circuit board and method of fabricating the same
by
HU, PEII
,
LIN, CHI-WEN
,
LEE
,
JUIUNG
Year of Publication
16.04.2022
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Clip
by
CHEN, CHAO-JUNG
,
LIN, CHIH-WEI
,
LEE
,
JUIUNG
,
SUK, HUI-YING
Year of Publication
01.03.2023
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Integrated circuit and method of operating the same
by
HUANG GUO-ZHEN
,
LEE JUIUNG
,
TU WEN-HUNG
Year of Publication
01.10.2013
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IC package tray embedded RFID
by
WANG LAN-BEN
,
LEE JUIUNG
,
KO CHUN-MING
Year of Publication
14.08.2012
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Leadframe
by
LEE KUN-FENG
,
LIN PO-HSIN
,
LEE JUIUNG
Year of Publication
13.03.2012
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INTEGRATED CIRCUIT AND METHOD OF OPERATING THE SAME
by
HUANG GUO-ZHEN
,
LEE JUIUNG
,
TU WEN-HUNG
Year of Publication
01.03.2012
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IC PACKAGE TRAY EMBEDDED RFID
by
WANG LAN-BEN
,
LEE JUIUNG
,
KO CHUN-MING
Year of Publication
03.02.2011
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Leadframe
by
LEE KUN-FENG
,
LIN PO-HSIN
,
LEE JUIUNG
Year of Publication
28.10.2010
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Package
by
CHIU, JING-MING
,
LEE, JI-GANG
,
LEE
,
JUIUNG
Year of Publication
01.05.2007
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SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF
by
LEE JUIUNG
,
LIN CHIH-WEN
,
TSAI CHEN-JUNG
Year of Publication
25.01.2007
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Semiconductor packaging device and manufacture thereof
by
LEE JUIUNG
,
LIN CHIH-WEN
,
TSAI CHEN-JUNG
Year of Publication
17.10.2006
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Multi-chip package
by
LEE JUIUNG
,
LEE JI-GANG
,
CHIU JING-MING
Year of Publication
12.09.2006
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Multi-chip package
by
LEE JUIUNG
,
LEE JI-GANG
,
CHIU JING-MING
Year of Publication
11.05.2006
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Semiconductor packaging device
by
LEE JUIUNG
,
LIN CHIH-WEN
,
TSAI CHEN-JUNG
Year of Publication
20.12.2005
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Leadframe
by
LEE KUN-FENG
,
LIN PO-HSIN
,
LEE JUIUNG
Year of Publication
09.01.2013
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IC package tray embedded RFID, manufacture station and electical component manufacture method
by
WANG LAN-BEN
,
LEE JUIUNG
,
KO CHUN-MING
Year of Publication
03.10.2012
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Multiple-step inner lead of leadframe
by
LIN, CHIH-WEN
,
TSAI, CHEN-JUNG
,
LEE
,
JUIUNG
Year of Publication
01.08.2004
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Ultra thin stacking packaging device
by
LEE JUIUNG
,
LIN CHIH-WEN
,
TSAI CHEN-JUNG
Year of Publication
05.02.2004
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Semiconductor package body having a lead frame with enhanced heat dissipation
by
LEE JUIUNG
,
LIN CHIH-WEN
,
TSAI CHEN-JUNG
Year of Publication
01.01.2004
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