Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
Lee, Youngseok, You, Yebin, Cho, Chulhee, Kim, Sijun, Lee, Jangjae, Kim, Minyoung, Lee, Hanglim, You, Youngjun, Kim, Kyungman, You, ShinJae
Published in Micromachines (Basel) (29.10.2022)
Published in Micromachines (Basel) (29.10.2022)
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Journal Article
Catalytic nickel silicide as an alternative to noble metals in metal-assisted chemical etching of silicon
Kim, Kyunghwan, Choi, Sunhae, Bong, Haekyun, Lee, Hanglim, Kim, Minyoung, Oh, Jungwoo
Published in Nanoscale (25.08.2023)
Published in Nanoscale (25.08.2023)
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Journal Article
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO[sub.2] Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
Lee, Youngseok, You, Yebin, Cho, Chulhee, Kim, Sijun, Lee, Jangjae, Kim, Minyoung, Lee, Hanglim, You, Youngjun, Kim, Kyungman, You, ShinJae
Published in Micromachines (Basel) (01.10.2022)
Published in Micromachines (Basel) (01.10.2022)
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Journal Article
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
JUNG BUYOUNG, LEE HANGLIM, CHOI MOONSIK, YANG SEUNGTAE, PARK JIHOON, KIM MINYOUNG
Year of Publication 08.07.2021
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Year of Publication 08.07.2021
Patent
APPARATUS AND METHOD FOR TREATING A SUBSTRATE
LIM JUNSUP, LEE HANGLIM, CHOI ENU HA, CHOI JINSUNG, PARK JIHOON, KIM MINYOUNG
Year of Publication 28.10.2020
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Year of Publication 28.10.2020
Patent
BONDING APPARATUS AND BONDING METHOD
KIM DOYEON, KIM KWANGSUP, JANG SOO ILL, LEE HANGLIM, GOH JUNGSUK, KIM MINYOUNG, PARK JIHOON
Year of Publication 23.07.2020
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Year of Publication 23.07.2020
Patent
APPARATUS AND METHOD FOR BONDING DIE OR SUBSTRATE
KIM DOYEON, LEE HANGLIM, KIM DONG HUN, GOH JUNGSUK, KIM MINYOUNG, PARK JIHOON
Year of Publication 29.04.2020
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Year of Publication 29.04.2020
Patent
BONDING APPARATUS AND BONDING METHOD
KIM DOYEON, KIM KWANGSUP, LEE CHOONGHYUN, LEE HANGLIM, KIM DO HEON, GOH JUNGSUK, KIM MINYOUNG
Year of Publication 01.06.2020
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Year of Publication 01.06.2020
Patent
BONDING APPARATUS AND BONDING METHOD
KIM DOYEON, KIM KWANGSUP, LEE CHOONGHYUN, JANG SOO ILL, LEE HANGLIM, LEE HYO SEOK, KIM DO HEON, GOH JUNGSUK, KIM YUNGI, KIM MINYOUNG, PARK JIHOON
Year of Publication 01.06.2020
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Year of Publication 01.06.2020
Patent
APPARATUS AND METHOD FOR MEASURING HYDROPHILICITY BONDING APPARATUS AND BONDING METHOD
KIM DOYEON, KIM KWANGSUP, JANG SOO ILL, LEE CHOONGHYUN, LEE HANGLIM, LEE HYO SEOK, KIM YUNGI, GOH JUNGSUK, KIM DO HEON, KIM MINYOUNG, PARK JIHOON
Year of Publication 29.05.2020
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Year of Publication 29.05.2020
Patent
APPARATUS AND METHOD FOR BONDING DIE AND SUBSTRATE
KIM DOYEON, KIM KWANGSUP, LEE CHOONGHYUN, JANG SOO ILL, LEE HANGLIM, LEE HYO SEOK, GOH JUNGSUK, KIM YUNGI, KIM DO HEON, KIM MINYOUNG, PARK JIHOON
Year of Publication 06.05.2020
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Year of Publication 06.05.2020
Patent