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Published in 2008 IEEE International Conference on Industrial Engineering and Engineering Management (01.12.2008)
Published in 2008 IEEE International Conference on Industrial Engineering and Engineering Management (01.12.2008)
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Conference Proceeding
Copper-clad plate, electronic component comprising same and manufacturing method of copper-clad plate
PARK JONG-YONG, JEONG WOO-DEUK, CHUNG SEUNG-MO, KANG HYEONG-DAE, LEE HA-SOO, LEE YONG-HO
Year of Publication 27.09.2022
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Year of Publication 27.09.2022
Patent