Eliminating Voids at Al2O3-Cu Interface During Direct Bonding
Lee, Shao-Kuan, Tuan, Wei-Hsing
Published in International journal of applied ceramic technology (01.09.2015)
Published in International journal of applied ceramic technology (01.09.2015)
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Journal Article
USING A SELF-ASSEMBLY LAYER TO FACILITATE SELECTIVE FORMATION OF AN ETCHING STOP LAYER
HUANG HSIN YEN, CHEN HAI CHING, LEE CHENG CHIN, LEE SHAO KUAN, WU YUNG HSU, SHUE SHAU LIN
Year of Publication 12.08.2021
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Year of Publication 12.08.2021
Patent
USING A SELF-ASSEMBLY LAYER TO FACILITATE SELECTIVE FORMATION OF AN ETCHING STOP LAYER
HUANG HSIN YEN, CHEN HAI CHING, LEE CHENG CHIN, LEE SHAO KUAN, WU YUNG HSU, SHUE SHAU LIN
Year of Publication 06.01.2020
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Year of Publication 06.01.2020
Patent
Scalable Spin-to-Charge Conversion Device with Nanopatterning
Lin, Yu-Lon, Wu, Yu-Hui, Lee, Shao-Kuan, Cheng, Chih-Wei, Chen, Jing-Wen, Chung, Chin-Han, Song, Ming-Yuan, Bao, Xinyu, Tseng, Yuan-Chieh
Published in ACS applied electronic materials (24.09.2024)
Published in ACS applied electronic materials (24.09.2024)
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Journal Article
Eliminating Voids at Al 2 O 3 –Cu Interface During Direct Bonding
Lee, Shao‐Kuan, Tuan, Wei‐Hsing
Published in International journal of applied ceramic technology (01.09.2015)
Published in International journal of applied ceramic technology (01.09.2015)
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Journal Article
Microstructure–thermal properties of Cu/Al2O3 bilayer prepared by direct bonding
Lee, Shao-Kuan, Tuan, Wei-Hsing, Wu, Yin-Yin, Shih, Shao-Ju
Published in Journal of the European Ceramic Society (01.02.2013)
Published in Journal of the European Ceramic Society (01.02.2013)
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Journal Article
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
SHUE, Shau-Lin, LEE, Shao-Kuan, HUANG, Hsin-Yen, LEE, Cheng-Chin, CHEN, Hai-Ching
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
Patent
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
SHUE, Shau-Lin, HUANG, Hsin-Yen, LEE, Shao-Kuan, LEE, Cheng-Chin, CHEN, Hai-Ching
Year of Publication 29.08.2024
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Year of Publication 29.08.2024
Patent
Heat dispersion layers for double sided interconnect
Shue, Shau-Lin, Lee, Shao-Kuan, Tsai, Cherng-Shiaw, Chang, Hsiao-Kang, Huang, Hsin-Yen
Year of Publication 27.08.2024
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Year of Publication 27.08.2024
Patent
SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
Shue, Shau-Lin, Lee, Shao-Kuan, Chen, Hai-Ching, Lee, Cheng-Chin, Huang, Hsin-Yen
Year of Publication 01.08.2024
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Year of Publication 01.08.2024
Patent
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
SHUE, Shau-Lin, LEE, Shao-Kuan, HUANG, Hsin-Yen, LEE, Cheng-Chin, CHEN, Hai-Ching
Year of Publication 13.06.2024
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Year of Publication 13.06.2024
Patent
Interconnect structure
Shue, Shau-Lin, Lee, Shao-Kuan, Chen, Hai-Ching, Lee, Cheng-Chin, Huang, Hsin-Yen
Year of Publication 11.06.2024
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Year of Publication 11.06.2024
Patent
Interconnect structure
Shue, Shau-Lin, Lee, Shao-Kuan, Chen, Hai-Ching, Lee, Cheng-Chin, Huang, Hsin-Yen
Year of Publication 04.06.2024
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Year of Publication 04.06.2024
Patent