Search Results - "LEE, Ming-Chiang" :: K.UTB vyhledávací portál

A novel FR-4 material for embedded substrate

by Chih-Wei Hong, Ming-Chiang Lee
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)

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Conference Proceeding

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SEMICONDUCTOR DEVICE PACKAGE

by LIN, Cheng-Nan, LEE, Ming-Chiang, YEH, Yung-I
Year of Publication 28.09.2023

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Patent

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SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

by LEE, Chun-Che, LEE, Ming-Chiang, YEN, You-Lung, CHEN, Tien-Szu, LEE, Chih-Cheng, SU, Yuan-Chang
Year of Publication 10.11.2022

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Patent

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Semiconductor substrate and method for manufacturing the same

by Lee, Chih-Cheng, Su, Yuan-Chang, Yen, You-Lung, Lee, Chun-Che, Chen, Tien-Szu, Lee, Ming-Chiang
Year of Publication 26.07.2022

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Patent

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The Measurement of the Relationship between Taiwan's Bond Funds' Net Flow and the Investment Risk -Threshold Autoregressive Model

by Wo-Chiang Lee, Joe-Ming Lee
Published in Asian economic and financial review (01.02.2014)

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Journal Article

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Semiconductor device package and method of manufacturing the same

by Zhuang, Chun-Jun, Fang, Hsu-Nan, Yeh, Yung I, Lee, Ming-Chiang
Year of Publication 06.10.2020

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Patent

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Quad flat non-leaded package and manufacturing method thereof

by Lee, Ming-Chiang
Year of Publication 09.08.2011

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Patent

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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

by Zhuang, Chun-Jun, Fang, Hsu-Nan, Yeh, Yung I, Lee, Ming-Chiang
Year of Publication 11.04.2019

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Patent

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SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

by Lee, Chih-Cheng, Su, Yuan-Chang, Yen, You-Lung, Lee, Chun-Che, Chen, Tien-Szu, Lee, Ming-Chiang
Year of Publication 16.05.2019

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Patent

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Semiconductor substrate mitigating bridging

by Lee, Chih-Cheng, Su, Yuan-Chang, Yen, You-Lung, Lee, Chun-Che, Chen, Tien-Szu, Lee, Ming-Chiang
Year of Publication 15.01.2019

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Patent

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Substrate structure and package structure using the same

by Fan Chen-Chuan, Chen Kuo-Hua, Lee Ming-Chiang, Lee Tsung-Hsun
Year of Publication 21.02.2017

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Patent

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Embedded component device and manufacturing methods thereof

by Lee Ming Chiang, Lee Chun-Che, Huang Shih-Fu, Su Yuan-Chang
Year of Publication 02.08.2016

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Patent

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Semiconductor package with embedded die and manufacturing methods thereof

by LEE MING CHIANG, ESSIG KAY STEPHAN, APPELT BERND KARL
Year of Publication 16.07.2013

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Patent

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Quad flat non-leaded package and manufacturing method thereof

by LEE, MING CHIANG
Year of Publication 11.09.2012

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Patent

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Semiconductor package structure and semiconductor process

by LIN, CHENG NAN, LEE, MING CHIANG, LIAO, KUO HSIEN
Year of Publication 21.07.2018

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Patent

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Semiconductor Package with Embedded Die and Manufacturing Methods Thereof

by LEE MING CHIANG, ESSIG KAY STEPHAN, APPELT BERND KARL
Year of Publication 20.09.2012

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Patent

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Semiconductor package with single sided substrate design and manufacturing methods thereof

by SU YUANANG, CHEN CHIANG, HUANG SHIH-FU, LEE MING CHIANG, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, APPELT BERND KARL
Year of Publication 24.11.2015

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Patent

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Semiconductor package with single sided substrate design and manufacturing methods thereof

by SU YUANANG, CHEN CHIANG, HUANG SHIH-FU, LEE MING CHIANG, CHEN TZU-HUI, CHEN KUANG-HSIUNG, HSIEH PAO-MING, APPELT BERND KARL
Year of Publication 25.03.2015

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Patent