Finite Element Analysis of Film Stack Architecture for Complementary Metal-Oxide-Semiconductor Image Sensors
Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang
Published in Sensors (Basel, Switzerland) (02.05.2017)
Published in Sensors (Basel, Switzerland) (02.05.2017)
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Journal Article
Adaptive process control of the changeover point for injection molding process
Chen, Yi-Sheng, Wu, Kuo-Tsai, Tsai, Ming-Hong, Hwang, Sheng-Jye, Lee, Huei-Huang, Peng, Hsin-Shu, Chu, Hsiao-Yeh
Published in Journal of low frequency noise, vibration, and active control (01.03.2021)
Published in Journal of low frequency noise, vibration, and active control (01.03.2021)
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Journal Article
Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process
Chen, Bo-Heng, Hwang, Sheng-Jye, Chang, Yu-Yang, Yang, Yu-Shuo, Lee, Huei-Huang, Huang, Bing-Yuan, Hu, Ian, Chen, Dao-Long, Tarng, David, Hung, C. P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
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Journal Article
Injection Molding Process Control of Servo–Hydraulic System
Lin, Chun-Ying, Shen, Fang-Cheng, Wu, Kuo-Tsai, Lee, Huei-Huang, Hwang, Sheng-Jye
Published in Applied sciences (01.01.2020)
Published in Applied sciences (01.01.2020)
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Journal Article
Study on Induction Heating Coil for Uniform Mold Cavity Surface Heating
Sung, Yu-Ting, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan
Published in Advances in Mechanical Engineering (01.01.2014)
Published in Advances in Mechanical Engineering (01.01.2014)
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Journal Article
Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill
Wu, Kuo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang
Published in Journal of electronic materials (01.08.2017)
Published in Journal of electronic materials (01.08.2017)
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Journal Article
Control of Hot Runner Type Micro Injection Molding Module
Cang-Chin Yang, Sheng-Jye Hwang, Huei-Huang Lee, Deng-Yuan Huang
Published in IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society (01.11.2007)
Published in IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society (01.11.2007)
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Conference Proceeding
New magnetic tweezers for investigation of the mechanical properties of single DNA molecules
Chiou, Chi-Han, Huang, Yu-Yen, Chiang, Meng-Han, Lee, Huei-Huang, Lee, Gwo-Bin
Published in Nanotechnology (14.03.2006)
Published in Nanotechnology (14.03.2006)
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Journal Article