A 32-Gb/s PAM4-Binary Bridge With Sampler Offset Cancellation for Memory Testing
Yun, Daeho, Lee, Eonhui, Jung, Woosong, Kim, Kahyun, Beak, Kyung-Min, Kim, Jihee, Lee, Hyun-Bae, Ko, Byeongseon, Choi, Woo-Seok, Jeong, Deog-Kyoon
Published in IEEE transactions on circuits and systems. II, Express briefs (01.09.2022)
Published in IEEE transactions on circuits and systems. II, Express briefs (01.09.2022)
Get full text
Journal Article
An On-Chip Monitoring Circuit for Signal-Integrity Analysis of 8-Gb/s Chip-to-Chip Interfaces With Source-Synchronous Clock
Lee, Pil-Ho, Lee, Han-Yeol, Lee, Hyun-Bae, Jang, Young-Chan
Published in IEEE transactions on very large scale integration (VLSI) systems (01.04.2017)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.04.2017)
Get full text
Journal Article
A 16Gb/s/pin 8Gb GDDR6 DRAM with bandwidth extension techniques for high-speed applications
Kyu-Dong Hwang, Boram Kim, Sang-Yeon Byeon, Kyu-Young Kim, Dae-Han Kwon, Hyun-Bae Lee, Geun-Il Lee, Sang-Sic Yoon, Jin-Youp Cha, Soo-Young Jang, Seung-Hun Lee, Yong-Suk Joo, Gang-Sik Lee, Sung-Soo Xi, Soo-Bin Lim, Kyung-Ho Chu, Joo-Hwan Cho, Junhyun Chun, Jonghoon Oh, Jinkook Kim, Seok-Hee Lee
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01.02.2018)
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01.02.2018)
Get full text
Conference Proceeding
A 1-V 1.6-GS/s 5.58-ENOB CMOS Flash ADC using Time-Domain Comparator
Lee, Han-Yeol, Jeong, Dong-Gil, Hwang, Yu-Jeong, Lee, Hyun-Bae, Jang, Young-Chan
Published in Journal of semiconductor technology and science (01.12.2015)
Published in Journal of semiconductor technology and science (01.12.2015)
Get full text
Journal Article
A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines
LEE, Kyoungho, LEE, Hyun-Bae, JUNG, Hae-Kang, SIM, Jae-Yoon, PARK, Hong-June
Published in IEEE transactions on advanced packaging (01.11.2008)
Published in IEEE transactions on advanced packaging (01.11.2008)
Get full text
Journal Article