A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network
RYU, Chunghyun, CHUNG, Daehyun, LEE, Choonheung, KIM, Jinhan, BAE, Kicheol, YU, Jiheon, LEE, Seungjae, KIM, Joungho
Published in IEEE microwave and wireless components letters (01.12.2006)
Published in IEEE microwave and wireless components letters (01.12.2006)
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Journal Article
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoijun Yoo, Kim, Joungho
Published in IEEE journal of solid-state circuits (01.01.2006)
Published in IEEE journal of solid-state circuits (01.01.2006)
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Conference Proceeding
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Yanggyoo Jung, Dongsu Ryu, Minho Gim, Choonghoe Kim, Yunseok Song, Jinyoung Kim, Juhoon Yoon, Choonheung Lee
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
High reliability packaging technologies and process for ultra low k Flip Chip devices
Joonyoung Park, YunHee Kim, SeokHo Na, JinYoung Kim, ChoonHeung Lee, Nicholls, Lou
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Copper foil exposed structure for thin PoP warpage improvement
YeSeul Ahn, JinSeong Kim, ChaGyu Song, GyuWan Han, JuHoon Yoon, ChoonHeung Lee
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Characterization of intermetallic compound (IMC) growth in Cu wire ball bonding on Al pad metallization
SeokHo Na, TaeKyeong Hwang, JungSoo Park, JinYoung Kim, HeeYeoul Yoo, ChoonHeung Lee
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jaedong Kim, Jinyoung Kim, Kicheol Bae, Jiheon Yu, Seungjae Lee, Hoijun Yoo, Kim, Joungho
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
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Conference Proceeding
Strip grinding introduction for thin PoP
Jinseong Kim, Yesul Ahn, Gyuwan Han, Byoungwoo Cho, Dongjoo Park, Juhoon Yoon, Choonheung Lee, Nicholls, Lou, Shengmin Wen
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Development of large die fine pitch flip chip BGA using TCNCP technology
Yanggyoo Jung, Minjae Lee, Sunwoo Park, Dongsu Ryu, Youshin Jung, Chanha Hwang, Choonheung Lee, Sungsoon Park, Jimarez, M., Myung-June Lee
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Study of interconnection process for fine pitch flip chip
Minjae Lee, Min Yoo, Jihee Cho, Seungki Lee, Jaedong Kim, Choonheung Lee, Daebyoung Kang, Zwenger, C., Lanzone, R.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Application of through mold via (TMV) as PoP base package
Jinseong Kim, Kiwook Lee, Dongjoo Park, Taekyung Hwang, Kwangho Kim, Daebyoung Kang, Jaedong Kim, Choonheung Lee, Scanlan, C., Berry, C.J., Zwenger, C., Smith, L., Dreiza, M., Darveaux, R.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Evaluation and verification of enhanced electrical performance of advanced coreless flip-chip BGA package with warpage measurement data
Ga Won Kim, Ji Heon Yu, Chul Woo Park, Seoung Joon Hong, Jin Young Kim, Rinne, G., ChoonHeung Lee
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor
GaWon Kim, SeungJae Lee, JiHeon Yu, GyuIck Jung, JinYoung Kim, Karim, N., HeeYeoul Yoo, ChoonHeung Lee
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Molded underfill development for flipstack CSP
JoonYeob Lee, KwangSeok Oh, ChanHa Hwang, ChoonHeung Lee, St. Amand, R.D.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array
Dong Gun Kam, Kim, Joungho, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee
Published in IEEE design & test of computers (01.05.2006)
Published in IEEE design & test of computers (01.05.2006)
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Journal Article
Electrical evaluation of wafer level fan out (WLFO) package using organic substrates for microwave applications
SeungJae Lee, SangWon Kim, GaWon Kim, KiCheol Bae, JiHeon Yu, JinYoung Kim, HeeYeoul Yoo, ChoonHeung Lee
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Electrical characterization of wafer level fan-out (WLFO) using film substrate for low cost millimeter wave application
SeungJae Lee, SangWon Kim, Karim, Nozad, Dunlap, Brett, BooYang Jung, KiCheol Bae, JiHeon Yu, YoungSuk Chung, ChanHa Hwang, JinYoung Kim, ChoonHeung Lee
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding