Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor–liquid crystal display applications
Yen, Yee-Wen, Kuo, Yu-Lin, Chen, Jian-Yu, Lee, Chiapyng, Lee, Chung-Yu
Published in Thin solid films (25.06.2007)
Published in Thin solid films (25.06.2007)
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Journal Article
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
Yen, Yee-Wen, Chou, Weng-Ting, Tseng, Yu, Lee, Chiapyng, Hsu, Chun-Lei
Published in Journal of electronic materials (01.01.2008)
Published in Journal of electronic materials (01.01.2008)
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Journal Article
Conference Proceeding
The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
Lin, Chung-Yung, Jao, Chien-Chung, Lee, Chiapyng, Yen, Yee-Wen
Published in Journal of alloys and compounds (16.08.2007)
Published in Journal of alloys and compounds (16.08.2007)
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Journal Article
Thermal stability, adhesion and electrical studies on (Ti,Zr)Nx thin films as low resistive diffusion barriers between Cu and Si
Huang, Cheng-Lin, Lai, Chih-Huang, Tsai, Po-Hao, Kuo, Yu-Lin, Lin, Jing-Cheng, Lee, Chiapyng
Published in Electronic materials letters (2014)
Published in Electronic materials letters (2014)
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Journal Article
A novel two-step MOCVD for producing thin copper films with a mixture of ethyl alcohol and water as the additive
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Journal Article
Conference Proceeding
Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target
KUO, Yu-Lin, HUANG, Jui-Jen, LIN, Shun-Tang, LEE, Chiapyng, LEE, Wen-Horng
Published in Materials chemistry and physics (26.06.2003)
Published in Materials chemistry and physics (26.06.2003)
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Journal Article
A comparative study of Ar and H2 as carrier gases for the growth of SiC films on Si(100) by electron cyclotron resonance chemical vapor deposition at low temperature
LEE, Wen-Horng, LIN, Jing-Cheng, CHIAPYNG LEE, CHENG, Huang-Chung, YEW, Tri-Rung
Published in Diamond and related materials (01.11.2001)
Published in Diamond and related materials (01.11.2001)
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Journal Article
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces
WU, Pei-Lin, HUANG, Meng-Kuang, CHIAPYNG LEE, TZAN, Shyh-Rong
Published in Journal of electronic materials (01.03.2004)
Published in Journal of electronic materials (01.03.2004)
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Journal Article
Surface Modification with Poly(sulfobetaine methacrylate-co-acrylic acid) To Reduce Fibrinogen Adsorption, Platelet Adhesion, and Plasma Coagulation
Kuo, Wei-Hsuan, Wang, Meng-Jiy, Chien, Hsiu-Wen, Wei, Ta-Chin, Lee, Chiapyng, Tsai, Wei-Bor
Published in Biomacromolecules (12.12.2011)
Published in Biomacromolecules (12.12.2011)
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