Fatigue life time modelling of Cu and Au fine wires
Khatibi, Golta, Mazloum-Nejadari, Ali, Lederer, Martin, Delshadmanesh, Mitra, Czerny, Bernhard
Published in MATEC Web of Conferences (01.01.2018)
Published in MATEC Web of Conferences (01.01.2018)
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Journal Article
Conference Proceeding
Analysis of the repeated absolute gravity measurements in the Czech Republic, Slovakia and Hungary from the period 1991–2010 considering instrumental and hydrological effects
Pálinkáš, Vojtech, Lederer, Martin, Kostelecký, Jakub, Šimek, Jaroslav, Mojzeš, Marcel, Ferianc, Dušan, Csapó, Géza
Published in Journal of geodesy (2013)
Published in Journal of geodesy (2013)
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Journal Article
Influence of Defects on High Cycle Fatigue Response of Ti45Nb Biocompatible Alloy
Danninger, Herbert, Lederer, Martin, Zehetbauer, Michael J., Khatibi, Golta, Delshadmanesh, Mitra
Published in Solid State Phenomena (08.12.2016)
Published in Solid State Phenomena (08.12.2016)
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Journal Article
A novel approach for evaluation of material interfaces in electronics
Khatibi, Golta, Czerny, Bernhard, Lassnig, Alice, Lederer, Martin, Nicolics, Johann, Magnien, Julien, Suhir, Ephraim
Published in 2016 IEEE Aerospace Conference (01.03.2016)
Published in 2016 IEEE Aerospace Conference (01.03.2016)
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Conference Proceeding
Thermomechanical Stresses in Copper Films at Elevated Temperature
LEDERER, Martin, ZARBAKHSH, Javad, RUI HUANG, DETZEL, Thomas, WEISS, Brigitte
Published in Journal of microelectronics and electronic packaging (01.04.2010)
Published in Journal of microelectronics and electronic packaging (01.04.2010)
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Journal Article
Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver
Gokce Gokdeniz, Zeynep, Lederer, Martin, Khatibi, Golta, Nicolics, Johann
Published in 2021 44th International Spring Seminar on Electronics Technology (ISSE) (05.05.2021)
Published in 2021 44th International Spring Seminar on Electronics Technology (ISSE) (05.05.2021)
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Conference Proceeding
Characterization methods for metallic wires in electronic packages
Lederer, Martin, Khatibi, Golta, Mazloum-Nejadari, Ali
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
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Conference Proceeding
Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading
Mazloum-Nejadari, Ali, Lederer, Martin, Khatibi, Golta, Czerny, Bernhard, Weiss, Laurens, Nicolics, Johann
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Modeling of multi-temperature-cycle wafer curvature
Zarbakhsh, Javad, Lederer, Martin, Rui Huang, Detzel, Thomas, Weiss, Brigitte
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding