SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
OSEOB JEON, RAJEEV JOSHI, YOONHWA, CHOI, BOON HUAN GOOI, BUYONG-OK LEE, CHUNG-LIN WU, VENKAT, IYER, LAY LEAP LIM, DAVID CHONG, TAN TEIK KENG, SHIBAEK NAM, MARIA CRISTINA B.ESTACIO
Year of Publication 15.12.2016
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Year of Publication 15.12.2016
Patent