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"LAW LAI CHENG"
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"LAW LAI CHENG"
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Systematic Pd Cu wire bond recipe development flow for successful qualification result
by
Law Lai Cheng
,
Wong Boh Kid
,
Hiew Pey Fang
,
Eu Poh Leng
Published in
2012 14th International Conference on Electronic Materials and Packaging (EMAP)
(01.12.2012)
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Device package with rigid interconnect structure connecting die and substrate and method thereof
by
LAW LAI CHENG
,
WONG BOH KID
,
YAP WENG FOONG
Year of Publication
06.01.2015
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Patent
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BRACE FOR BOND WIRE
by
LAI CHENG LAW
,
WENG FOONG YAP
,
BOH KID WONG
Year of Publication
22.09.2014
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Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires
by
LAW LAI CHENG
,
WONG BOH KID
,
YAP WENG F
Year of Publication
03.06.2014
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Brace for bond wire
by
LAW LAI CHENG
,
WONG BOH KID
,
YAP WENG FOONG
Year of Publication
25.03.2014
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DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND SUBSTRATE AND METHOD THEREOF
by
LAI CHENG LAW
,
WENG FOONG YAP
,
BOH KID WONG
Year of Publication
30.01.2014
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Device package with rigid interconnect structure connecting die and substrate and method thereof
by
WONG, BOH KID
,
LAW
,
LAI CHENG
,
YAP, WENG FOONG
Year of Publication
15.01.2014
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DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND SUBSTRATE AND METHOD THEREOF
by
LAW LAI CHENG
,
WONG BOH KID
,
YAP WENG FOONG
Year of Publication
09.01.2014
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SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL
by
LAW LAI CHENG
,
LEE SEOK KHOON
,
YAP WENG FOONG
Year of Publication
26.12.2013
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MULTI-CORE WIRE
by
LAW LAI CHENG
,
LEE SEOK KHOON
,
SIONG CHIN TECK
Year of Publication
05.12.2013
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CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
by
LAW LAI CHENG
,
YAP JIA LIN
,
AU YIN KHENG
Year of Publication
25.12.2014
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Brace for bond wire
by
LAI CHENG LAW
,
WENG FOONG YAP
,
BOH KID WONG
Year of Publication
17.09.2014
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