Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices
El Hasni, Akram, Pfirrmann, Stefan, Kolander, Anett, Yacoub-George, Erwin, König, Martin, Landesberger, Christof, Voigt, Anja, Grützner, Gabi, Schnakenberg, Uwe
Published in Microfluidics and nanofluidics (01.03.2017)
Published in Microfluidics and nanofluidics (01.03.2017)
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Journal Article
Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan, Hell, Waltraud, Drost, Andreas, Landesberger, Christof, Kutter, Christoph, Bock, Karlheinz
Published in Electronics (Basel) (01.02.2020)
Published in Electronics (Basel) (01.02.2020)
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Journal Article
Analysis of wafer bonding by infrared transmission
BOLLMANN, D, LANDESBERGER, C, RAMM, P, HABERGER, K
Published in Japanese Journal of Applied Physics (01.07.1996)
Published in Japanese Journal of Applied Physics (01.07.1996)
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Journal Article
Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process
Bose, Indranil, Palavesam, Nagarajan, Hochreiter, Christian, Landesberger, Christof, Kutter, Christoph
Published in 2018 48th European Solid-State Device Research Conference (ESSDERC) (01.09.2018)
Published in 2018 48th European Solid-State Device Research Conference (ESSDERC) (01.09.2018)
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Conference Proceeding
Investigations of the influence of dicing techniques on the strength properties of thin silicon
Schoenfelder, Stephan, Ebert, Matthias, Landesberger, Christof, Bock, Karlheinz, Bagdahn, Jörg
Published in Microelectronics and reliability (01.02.2007)
Published in Microelectronics and reliability (01.02.2007)
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Journal Article
Conference Proceeding
Roll-to-roll hot embossing of microstructures
Velten, Thomas, Bauerfeld, Frank, Schuck, Herbert, Scherbaum, Sabine, Landesberger, Christof, Bock, Karlheinz
Published in Microsystem technologies (01.04.2011)
Published in Microsystem technologies (01.04.2011)
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Journal Article
Conference Proceeding
Selective one-step plasma patterning process for fluidic self-assembly of silicon chips
Bock, K., Scherbaum, S., Yacoub-George, E., Landesberger, C.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding