Thermal stability of modified surface microstructure on WC-Co cemented carbide after high current pulsed electron beam irradiation
Peng, Wenhai, Hao, Shengzhi, Zhao, Limin, Li, Ziqi, Chen, Jun, Lan, Jia’ni, Wang, Xinglei, Wang, Kaiyi
Published in Journal of alloys and compounds (15.07.2020)
Published in Journal of alloys and compounds (15.07.2020)
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Journal Article
Towards a Random Walk Controller for Block Management and Wear Leveling in Flash Memory
Jiani Lan, Hao Wang, Xinyuan Lou
Published in 2015 IEEE International Conference on Smart City/SocialCom/SustainCom (SmartCity) (01.12.2015)
Published in 2015 IEEE International Conference on Smart City/SocialCom/SustainCom (SmartCity) (01.12.2015)
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Conference Proceeding
Effect of compressive stress on microstructural evolution of Sn-Bi-Ag/Sn-Ag-Cu hybrid BGA solder joints assembled by low-temperature soldering
Ren, Jing, Lan, Jiani, Huang, Feifei, Huang, Mingliang
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Low-melting-point In-Bi-Sn-Ag alloy brazing filler metal and preparation method and application thereof
GU YIBING, REN JING, HUANG MINGLIANG, HUANG FEIFEI, YANG HAOQI, LAN JIANI
Year of Publication 09.04.2024
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Year of Publication 09.04.2024
Patent