Search Results - "LAN, Je-Hsiung" :: K.UTB vyhledávací portál

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Planarized copper gate hydrogenated amorphous-silicon thin-film transistors for AM-LCDs

by Je-Hsiung Lan, Kanicki, J.
Published in IEEE electron device letters (01.03.1999)

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Journal Article

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Patterning of transparent conducting oxide thin films by wet etching for a-Si:H TFT-LCDs

by LAN, J.-H, KANICKI, J, CATALANO, A, KEANE, J, DEN BOER, W, GU, T
Published in Journal of electronic materials (01.12.1996)

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Journal Article

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ITO surface ball formation induced by atomic hydrogen in PECVD and HW-CVD tools

by Lan, Je-Hsiung, Kanicki, Jerzy
Published in Thin solid films (1997)

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Journal Article

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HIGH PERFORMANCE TUNABLE FILTER USING GALLIUM ARSENIDE

by KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 17.05.2023

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Patent

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High performance tunable filter

by Lan, Je-Hsiung, Kim, Jonghae
Year of Publication 16.05.2023

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Patent

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BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER

by LIU, Kai, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 21.08.2024

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Patent

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HIGH DENSITY SILICON BASED CAPACITOR

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 31.07.2024

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Patent

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Thermal bridge interposer structure

by Lan, Je-Hsiung, Dutta, Ranadeep, Kim, Jonghae
Year of Publication 23.07.2024

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Patent

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CAVITY-EMBEDDED TUNABLE FILTER

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 18.07.2024

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Patent

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CAVITY-EMBEDDED TUNABLE FILTER

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 18.07.2024

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Patent

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SURFACE ACOUSTIC WAVE (SAW) FILTER PACKAGES EMPLOYING AN ENHANCED THERMALLY CONDUCTIVE CAVITY FRAME FOR HEAT DISSIPATION, AND RELATED FABRICATION METHODS

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 03.07.2024

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Patent

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THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 20.06.2024

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Patent

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THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 20.06.2024

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Patent

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Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

by Lan, Je-Hsiung, Dutta, Ranadeep, Kim, Jonghae
Year of Publication 14.05.2024

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Patent

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3D INDUCTOR DESIGN USING BUNDLE SUBSTRATE VIAS

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 24.04.2024

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Patent

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ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 21.03.2024

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Patent

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ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 21.03.2024

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Patent

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RADIO FREQUENCY FRONT END (RFFE) HETERO-INTEGRATION

by DUTTA, Ranadeep, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 06.03.2024

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Patent

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Device on ceramic substrate

by Lan, Je-Hsiung, Dutta, Ranadeep, Kim, Jonghae
Year of Publication 17.10.2023

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Patent

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INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC MATERIAL

by LIU, Kai, KIM, Jonghae, LAN, Je-Hsiung
Year of Publication 28.09.2023

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Patent

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