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LEAD-FREE HIGH TEMPERATURE TIN BASED MULTI-COMPONENT SOLDER

LEAD-FREE HIGH TEMPERATURE TIN BASED MULTI-COMPONENT SOLDER

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 26.12.1997

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Patent

Soldering iron tip

Soldering iron tip

by BOLL; STEPHEN E, LAKE; JAMES KENNETH, LONG; RANDY C, ZIOLKOWSKI; PETER MICHAEL
Year of Publication 01.02.2000

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Patent

Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium

Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 19.05.1999

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Patent

Lead-free, tin, antimony, bismuth, copper solder alloy

Lead-free, tin, antimony, bismuth, copper solder alloy

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 19.05.1999

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Patent

Lead-free, high-temperature, tin based multi-component solder

Lead-free, high-temperature, tin based multi-component solder

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 28.04.1999

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Patent

Lead free, tin-bismuth solder alloys

Lead free, tin-bismuth solder alloys

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 28.04.1999

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Patent

LEAD-FREE, TIN, ANTIMONY, BISMTUH, COPPER SOLDER ALLOY

LEAD-FREE, TIN, ANTIMONY, BISMTUH, COPPER SOLDER ALLOY

by LONG RANDLY CLINTON, GONYA, STEPHEN GILBERT, WILD, ROGER CLINTON, LAKE, JAMES KENNETH
Year of Publication 26.12.1997

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Patent

LEED FREE TIN-BISMUTH SOLDER ALLOY

LEED FREE TIN-BISMUTH SOLDER ALLOY

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 03.12.1997

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Patent

Lead-free, tin, antimony, bismuth, copper solder alloy

Lead-free, tin, antimony, bismuth, copper solder alloy

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 21.12.1994

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Patent

Lead-free, high-temperature, tin based multi-component solder

Lead-free, high-temperature, tin based multi-component solder

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 21.12.1994

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Patent

High temperature, lead-free, tin based solder composition

High temperature, lead-free, tin based solder composition

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 21.12.1994

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Patent

Lead free, tin-bismuth solder alloys

Lead free, tin-bismuth solder alloys

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 21.12.1994

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Patent

Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium

Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 21.12.1994

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Patent

Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure

Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure

by LONG, RANDY CLINTON, WILD, ROGER NEIL, AGARWALA, BIRENDRA NATH, GONYA, STEPHEN GILBERG, LAKE, JAMES KENNETH, ROEDER, JEFFREY FREDERICK
Year of Publication 07.10.1992

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Patent

Lead-free, tin based solder composition

Lead-free, tin based solder composition

by GONYA, STEPHEN GILBERT, LONG, RANDY CLINTON, WILD, ROGER NEIL, LAKE, JAMES KENNETH
Year of Publication 01.07.1999

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Patent

DE2021611

DE2021611

by GROVER, SCOTT CARL, SOTH BOUNTIFUL, UTAH, US, RICHENS, KENNETH ARNOLD, SALT LAKE CITY UTAH, US, ALLRED, JAMES KENNETH, SALT LAKE CITY UTAH, UTAH, US, SHOCK, JAMES HARRINGTON, LAKEWOOD, COL., US
Year of Publication 22.12.1983

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Patent