Electrical testing of blind Through-Silicon Via (TSV) for 3D IC integration
Jui-Feng Hung, Lau, J. H., Peng-Shu Chen, Shih-Hsien Wu, Shinn-Juh Lai, Ming-Lin Li, Shyh-Shyuan Sheu, Pei-Jer Tzeng, Zhe-Hui Lin, Tzu-Kun Ku, Wei-Chung Lo, Ming-Jer Kao
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Design and implementation of mobile communications SiP modules with embedded components in multilayer organic hybrid substrate
Cheng-Hua Tsai, Li-Chi Chang, Chang-Sheng Chen, Syun Yu, Chin-Sun Shyu, Shinn-Juh Lai, Jungle Lee
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration
SHEU, Shyh-Shyuan, LIN, Zhe-Hui, KU, Tzu-Kun, LO, Wei-Chung, KAO, Ming-Jer, HUNG, Jui-Feng, LAU, John H, CHEN, Peng-Shu, WU, Shih-Hsien, SU, Keng-Li, LIN, Chih-Sheng, LAI, Shinn-Juh, CHENG, Kuo-Hsing
Published in Journal of microelectronics and electronic packaging (01.10.2011)
Published in Journal of microelectronics and electronic packaging (01.10.2011)
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Journal Article
The database of Embedded Passives for RF-SiP design
Hsun Yu, Wei-Ting Chen, Wei Li, Chang-Sheng Chen, Ra-Min Tain, Cheng-Hua Tsai, Meng-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Chin-Sun Shyu, Shinn-Juh Lai, Min-Lin Lee
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
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Conference Proceeding
A mobile WiMAX RF front-end module with integrated passive components and novel material
Wei-Ting Chen, Chang-Sheng Chen, Cheng-Hua Tsai, Kuo-Chiang Chin, Shinn-Juh Lai
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Capacitor devices with a filter structure
Chang, Huey-Ru, Lee, Min-Lin, Perng, Jiin-Shing, Hung, Sheng-Che, Lai, Shinn-Juh
Year of Publication 07.08.2012
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Year of Publication 07.08.2012
Patent
Capacitor devices with a filter structure
LAI SHINN-JUH, HUNG SHENG, PERNG JIIN-SHING, LEE MIN-LIN, CHANG HUEY-RU
Year of Publication 07.08.2012
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Year of Publication 07.08.2012
Patent
Capacitor devices having multi-sectional conductors
Hsu, Chien-Min, Lee, Min-Lin, Lai, Shinn-Juh, Chang, Huey-Ru, Hong, Ray-Fong
Year of Publication 12.06.2012
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Year of Publication 12.06.2012
Patent
Mirror image shielding structure
Jow, Uei-Ming, Shyu, Chin-Sun, Chen, Chang-Sheng, Lee, Min-Lin, Lai, Shinn-Juh
Year of Publication 15.05.2012
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Year of Publication 15.05.2012
Patent
Mirror image shielding structure
LAI SHINN-JUH, CHEN CHANG-SHENG, JOW UEI-MING, LEE MIN-LIN, SHYU CHIN-SUN
Year of Publication 15.05.2012
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Year of Publication 15.05.2012
Patent
Capacitor structure
LAI SHINN-JUH, WU SHIH-HSIEN, CHEN MENG-HUA, LIU SHUR-FEN, HUNG CHIN-HSIEN, LEE MIN-LIN
Year of Publication 16.07.2013
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Year of Publication 16.07.2013
Patent