by Lai, Jerander, Chen, Yi-Wei, Ho, Nien-Ting, Shiu, Yu Shan, Lin, J.F., Lei, Shuen Chen, Chang, Nick Z.H., Chou, Ling Chun, Huang, C.C., Wu, J.Y.
Published in Microelectronic engineering (01.04.2012)

by LAI, Jerander, CHEN, Yi-Wei, HO, Nien-Ting, YU SHAN SHIU, LIN, J. F, SHUEN CHEN LEI, CHANG, Nick Z. H, LING CHUN CHOU, HUANG, C. C, WU, J. Y
Published in Microelectronic engineering (01.04.2012)

by Tsai, T.C., Chen, Y.W., Lai, Jerander, Lin, J.F., Huang, C.C., Wu, J.Y.
Published in Microelectronic engineering (01.04.2012)

by Yi-Wei Chen, Nien-Ting Ho, Lai, J, Lin, J F, Huang, C C, Wu, J Y, Chu, J M M, Butterbaugh, J W
Published in 2010 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2010)

by Pin Hong Chen, Chia Chang Hsu, Lai, Jerander, Liao, Boris, Chun Ling Lin, Huang, Olivia, Chun Chieh Chiu, Hsu, C. M., Wu, J. Y.
Published in IEEE International Interconnect Technology Conference (01.05.2014)

by Lai, J., Yi-Wei Chen, Nien-Ting Ho, Lin, J. F., Huang, C. C., Wu, J. Y.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)

by Yi-Wei Chen, Nien-Ting Ho, Lai, J., Tsai, T.C., Huang, C.C., Wu, J.Y., Ng, B., Mayur, A.J., Tang, A., Muthukrishnan, S., Zelenko, J., Yang, H.
Published in 2009 17th International Conference on Advanced Thermal Processing of Semiconductors (01.09.2009)

by CHEN BELLA, LIN CHIN-HSIANG, LIU CHIHIEN, LAI JERANDER
Year of Publication 27.07.2006

by LIU, CHIHIEN, CHEN, BELLA, LIN, CHIN-HSIANG, LAI, JERANDER
Year of Publication 01.05.2006

by LIU, CHIHIEN, CHEN, BELLA, LIN, CHIN-HSIANG, LAI, JERANDER
Year of Publication 16.08.2006