ANNEALING PROCESS FOR ANNEALING A STRUCTURE
BARGE THIERRY, LAGAHE BLANCHARD CHRYSTELLE, ASPAR BERNARD, SOUSBIE NICOLAS
Year of Publication 02.08.2011
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Year of Publication 02.08.2011
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Distortion Free Wafer Bonding Technology for Backside Illumination Image Sensors
Broekaart, Marcel, Castex, Arnaud, Landry, Karine, Fontaniere, Richard, Lagahe-Blanchard, Chrystelle
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
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Investigation of a Sequential Three-Dimensional Process for Back-Illuminated CMOS Image Sensors With Miniaturized Pixels
Coudrain, P., Magnan, P., Batude, P., Gagnard, X., Leyris, C., Vinet, M., Castex, A., Lagahe-Blanchard, C., Pouydebasque, A., Cazaux, Y., Giffard, B., Ancey, P.
Published in IEEE transactions on electron devices (01.11.2009)
Published in IEEE transactions on electron devices (01.11.2009)
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Journal Article
Investigation of a Sequential Three-Dimensional Process for Back-Illuminated CMOS Image : SOLID-STATE IMAGE SENSORS
COUDRAIN, Perceval, MAGNAN, Pierre, GIFFARD, Benoit, ANCEY, Pascal, BATUDE, Perrine, GAGNARD, Xavier, LEYRIS, Cédric, VINET, Maud, CASTEX, Arnaud, LAGAHE-BLANCHARD, Chrystelle, POUYDEBASQUE, Arnaud, CAZAUX, Yvon
Published in IEEE transactions on electron devices (2009)
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Published in IEEE transactions on electron devices (2009)
Journal Article
New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers
Aspar, Bernard, Lagahe-Blanchard, Chrystelle, Sousbie, Nicolas, Margail, Jacques, Moriceau, H.
Published in ECS transactions (20.10.2006)
Published in ECS transactions (20.10.2006)
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Journal Article
METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES
ZUSSY, Marc, LAGAHE-BLANCHARD, Chrystelle, MORICEAU, Hubert, ASPAR, Bernard
Year of Publication 22.05.2019
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Year of Publication 22.05.2019
Patent