Search Results - "LAFONTAINE, JR. WILLIAM RENA" :: K.UTB vyhledávací portál

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Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

by LaFontaine, Jr., William Rena, Mescher, Paul Allen, Woychik, Charles Gerard
Year of Publication 23.11.2004

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Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

by MESCHER, PAUL ALLEN, LAFONTAINE, WILLIAM RENA, JR, WOYCHIK, CHARLES GERARD
Year of Publication 15.05.1996

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Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

by MESCHER, PAUL ALLEN, LAFONTAINE, WILLIAM RENA, JR, WOYCHIK, CHARLES GERARD
Year of Publication 02.08.1995

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Patent

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Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

by MESCHER PAUL ALLEN, LAFONTAINE, JR. WILLIAM RENA, WOYCHIK CHARLES GERARD
Year of Publication 23.11.2004

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Patent

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Semiconductor chip package

by MESCHER PAUL ALLEN, LAFONTAINE, JR. WILLIAM RENA, WOYCHIK CHARLES GERARD
Year of Publication 25.09.2001

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Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

by LAFONTAINE, JR.; WILLIAM RENA, MESCHER; PAUL ALLEN, WOYCHIK; CHARLES GERARD
Year of Publication 19.12.2000

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Patent

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Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion

by LAFONTAINE, JR.; WILLIAM RENA, MESCHER; PAUL ALLEN, WOYCHIK; CHARLES GERARD
Year of Publication 10.10.2000

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Patent

Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

Semiconductor chip package

Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package

Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion

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