Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
Loubet, N., Hook, T., Montanini, P., Yeung, C-W, Kanakasabapathy, S., Guillom, M., Yamashita, T., Zhang, J., Miao, X., Wang, J., Young, A., Chao, R., Kang, M., Liu, Z., Fan, S., Hamieh, B., Sieg, S., Mignot, Y., Xu, W., Seo, S-C, Yoo, J., Mochizuki, S., Sankarapandian, M., Kwon, O., Carr, A., Greene, A., Park, Y., Frougier, J., Galatage, R., Bao, R., Shearer, J., Conti, R., Song, H., Lee, D., Kong, D., Xu, Y., Arceo, A., Bi, Z., Xu, P., Muthinti, R., Li, J., Wong, R., Brown, D., Oldiges, P., Robison, R., Arnold, J., Felix, N., Skordas, S., Gaudiello, J., Standaert, T., Jagannathan, H., Corliss, D., Na, M-H, Knorr, A., Wu, T., Gupta, D., Lian, S., Divakaruni, R., Gow, T., Labelle, C., Lee, S., Paruchuri, V., Bu, H., Khare, M.
Published in 2017 Symposium on VLSI Technology (01.06.2017)
Published in 2017 Symposium on VLSI Technology (01.06.2017)
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Conference Proceeding
Manitoba-oculo-tricho-anal (MOTA) syndrome is caused by mutations in FREM1
Slavotinek, Anne M, Baranzini, Sergio E, Schanze, Denny, Labelle-Dumais, Cassandre, Short, Kieran M, Chao, Ryan, Yahyavi, Mani, Bijlsma, Emilia K, Chu, Catherine, Musone, Stacey, Wheatley, Ashleigh, Kwok, Pui-Yan, Marles, Sandra, Fryns, Jean-Pierre, Maga, A Murat, Hassan, Mohamed G, Gould, Douglas B, Madireddy, Lohith, Li, Chumei, Cox, Timothy C, Smyth, Ian, Chudley, Albert E, Zenker, Martin
Published in Journal of medical genetics (01.06.2011)
Published in Journal of medical genetics (01.06.2011)
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Journal Article
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
AUGUR, R, CHILD, C, QUON, R, KIM, B, SHENG, H, HIROOKA, S, GUPTA, R, THOMAS, A, SINGH, S. M, FANG, Q, SCHIWON, R, HAMIEH, B, AHN, J. H, WORNYO, E, ALLEN, S, KALTALIOGLU, E, RIBES, G, ZHANG, G, FRYXELL, T, OGINO, A, SHIMADA, E, AIZAWA, H, MINDA, H, TANG, T. J, KIM, S. O, OKI, T, FUJII, K, PALLACHALIL, M, TAKEWAKI, T, HU, C. K, SUNDLOF, B, PERMANA, D, BOLOM, T, ENGEL, B, CLEVENGER, L, LABELLE, C, SAPP, B, NOGAMI, T, SIMON, A, SHOBHA, H, GATES, S, RYAN, E. T, BONILLA, G, DAUBENSPECK, T, SHAW, T, KIOUSSIS, D, OSBORNE, G, GRILL, A, EDELSTEIN, D, RESTAINO, D, MOLIS, S, SPOONER, T, FERREIRA, P, BIERY, G, SAMPSON, R, MASUDA, H, SRIVASTAVA, R, ODA, Y, OGUMA, H
Published in Microelectronic engineering (01.04.2012)
Published in Microelectronic engineering (01.04.2012)
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Conference Proceeding
Journal Article
Tungsten and cobalt metallization: A material study for MOL local interconnects
Kamineni, V., Raymond, M., Siddiqui, S., Mont, F., Tsai, S., Niu, C., Labonte, A., Labelle, C., Fan, S., Peethala, B., Adusumilli, P., Patlolla, R., Priyadarshini, D., Mignot, Y., Carr, A., Pancharatnam, S., Shearer, J., Surisetty, C., Arnold, J., Canaperi, D., Haran, B., Jagannathan, H., Chafik, F., L'Herron, B.
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
Xie, R., Montanini, P., Akarvardar, K., Tripathi, N., Haran, B., Johnson, S., Hook, T., Hamieh, B., Corliss, D., Wang, J., Miao, X., Sporre, J., Fronheiser, J., Loubet, N., Sung, M., Sieg, S., Mochizuki, S., Prindle, C., Seo, S., Greene, A., Shearer, J., Labonte, A., Fan, S., Liebmann, L., Chao, R., Arceo, A., Chung, K., Cheon, K., Adusumilli, P., Amanapu, H. P., Bi, Z., Cha, J., Chen, H.-C, Conti, R., Galatage, R., Gluschenkov, O., Kamineni, V., Kim, K., Lee, C., Lie, F., Liu, Z., Mehta, S., Miller, E., Niimi, H., Niu, C., Park, C., Park, D., Raymond, M., Sahu, B., Sankarapandian, M., Siddiqui, S., Southwick, R., Sun, L., Surisetty, C., Tsai, S., Whang, S., Xu, P., Xu, Y., Yeh, C., Zeitzoff, P., Zhang, J., Li, J., Demarest, J., Arnold, J., Canaperi, D., Dunn, D., Felix, N., Gupta, D., Jagannathan, H., Kanakasabapathy, S., Kleemeier, W., Labelle, C., Mottura, M., Oldiges, P., Skordas, S., Standaert, T., Yamashita, T., Colburn, M., Na, M., Paruchuri, V., Lian, S., Divakaruni, R., Gow, T., Lee, S., Knorr, A., Bu, H., Khare, M.
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
Published in 2016 IEEE International Electron Devices Meeting (IEDM) (01.12.2016)
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Conference Proceeding
Pull-Out Strength of Screws in Screw Chases: Part 2
LaBelle, James C., Dolby, Tanya A., Kissell, J. Randolph
Published in Key Engineering Materials (01.09.2016)
Published in Key Engineering Materials (01.09.2016)
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Journal Article
Pull-Out Strength of Screws in Screw Chases: Part 1
LaBelle, James C., Dolby, Tanya A., Kissell, J. Randolph
Published in Key Engineering Materials (01.09.2016)
Published in Key Engineering Materials (01.09.2016)
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Journal Article
Tapering off and returning to buprenorphine maintenance in a primary care Office Based Addiction Treatment (OBAT) program
Weinstein, Zoe M., Gryczynski, Gabriela, Cheng, Debbie M., Quinn, Emily, Hui, David, Kim, Hyunjoong W., Labelle, Colleen, Samet, Jeffrey H.
Published in Drug and alcohol dependence (01.08.2018)
Published in Drug and alcohol dependence (01.08.2018)
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Journal Article
Disseminated intravascular coagulation: treat the cause, not the lab values
Labelle, Carrie Ann, Kitchens, Craig S
Published in Cleveland Clinic journal of medicine (01.05.2005)
Published in Cleveland Clinic journal of medicine (01.05.2005)
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Journal Article
Impact of HF-based cleaning solutions on via resistance for sub-10nm BEOL structures
Peethala, B., Mont, F.W., Molis, S., Knarr, R., L'lherron, B., Labelle, C., Canaperi, D., Siddiqui, S.
Published in Microelectronic engineering (01.08.2016)
Published in Microelectronic engineering (01.08.2016)
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Journal Article
Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures
Peethala, B., Mont, F.W., Molis, S., Knarr, R., L'lherron, B., Labelle, C., Canaperi, D., Siddiqui, S.
Published in Microelectronic engineering (01.08.2016)
Published in Microelectronic engineering (01.08.2016)
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Journal Article