Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
Published in IEEE journal of selected topics in quantum electronics (01.05.2023)
Published in IEEE journal of selected topics in quantum electronics (01.05.2023)
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Journal Article
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision
Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
Published in IEEE journal of selected topics in quantum electronics (2022)
Published in IEEE journal of selected topics in quantum electronics (2022)
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Journal Article
Three-dimensional integrated circuits
Topol, A. W., Tulipe, D. C. La, Shi, L., Frank, D. J., Bernstein, K., Steen, S. E., Kumar, A., Singco, G. U., Young, A. M., Guarini, K. W., Ieong, M.
Published in IBM journal of research and development (01.07.2006)
Published in IBM journal of research and development (01.07.2006)
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Journal Article
Collective Cu-Cu Thermocompression Bonding Using Pillars
Carroll, Robert, La Tulipe, Douglas, Coolbaugh, Douglas, Geer, Robert
Published in Journal of microelectronics and electronic packaging (01.01.2019)
Published in Journal of microelectronics and electronic packaging (01.01.2019)
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Journal Article
Wafer-level 3D integration technology
Koester, S. J., Young, A. M., Yu, R. R., Purushothaman, S., Chen, K.-N., La Tulipe, D. C., Rana, N., Shi, L., Wordeman, M. R., Sprogis, E. J.
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Fundamental study of IMC grains at low anneal temperature
Gerets, Carine, Derakhshandeh, Jaber, Shafahian, Ehsan, Cochet, Tom, Charles La Tulipe, Douglas, Beyer, Gerald, Miller, Andy, Beyne, Eric
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber, Beyne, Eric, Beyer, Gerald, Capuz, Giovanni, Cherman, Vladimir, De Preter, Inge, Gerets, Carine, Shafahian, Ehsan, Kennes, Koen, Jamieson, Geraldine, Cochet, Tom, Webers, Tomas, Tobback, Bert, Van der Plas, Geert, La Tulipe, Douglas Charles, Phommahaxay, Alain, Miller, Andy
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel, Kennes, Koen, Bex, Pieter, Jourdain, Anne, Teugels, Lieve, Walsby, Edward, Bolton, Chris, Patel, Jash, Ashraf, Huma, Barnett, Richard, Fodor, Ferenc, Phommahaxay, Alain, La Tulipe, Douglas, Beyer, Gerald, Beyne, Eric
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Confined IMCs for low temperature and high throughput D2W bonding
Derakhshandeh, Jaber, La Tulipe, Douglas Charles, Capuz, Giovanni, Cherman, Vladimir, Gerets, Carine, Cochet, Tom, Shafahian, Ehsan, Preter, Inge De, Jamieson, Geraldine, Webers, Tomas, Beyne, Eric, Beyer, Gerald, Miller, Andy
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
Two-stage expanded beam optical coupling
Van Campenhout, Joris, Kim, Do Won, La Tulipe, Douglas Charles, Van Steenberge, Geert, Missinne, Jeroen, He, Junwen, Yilmaz, Yigit
Year of Publication 30.01.2024
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Year of Publication 30.01.2024
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Photonics optoelectrical system
Leake, Jr., Gerald L, Charles, William, Coolbaugh, Douglas, La Tulipe, Douglas
Year of Publication 10.01.2023
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Year of Publication 10.01.2023
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Heterogeneous structure on an integrated photonics platform
Morton, Paul A, Coolbaugh, Douglas, La Tulipe, Douglas, Usechak, Nicholas G
Year of Publication 10.01.2023
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Year of Publication 10.01.2023
Patent
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10\mu \mathrm pitch microbumps
Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
TWO-STAGE EXPANDED BEAM OPTICAL COUPLING
Van Campenhout, Joris, Kim, Do Won, La Tulipe, Douglas Charles, Van Steenberge, Geert, Missinne, Jeroen, He, Junwen, Yilmaz, Yigit
Year of Publication 12.05.2022
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Year of Publication 12.05.2022
Patent