Search Results - "LA TULIPE, DOUGLAS" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision

by Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
Published in IEEE journal of selected topics in quantum electronics (01.05.2023)

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Journal Article

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

by Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
Published in IEEE journal of selected topics in quantum electronics (2022)

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Journal Article

Three-dimensional integrated circuits

Three-dimensional integrated circuits

by Topol, A. W., Tulipe, D. C. La, Shi, L., Frank, D. J., Bernstein, K., Steen, S. E., Kumar, A., Singco, G. U., Young, A. M., Guarini, K. W., Ieong, M.
Published in IBM journal of research and development (01.07.2006)

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Journal Article

Collective Cu-Cu Thermocompression Bonding Using Pillars

Collective Cu-Cu Thermocompression Bonding Using Pillars

by Carroll, Robert, La Tulipe, Douglas, Coolbaugh, Douglas, Geer, Robert
Published in Journal of microelectronics and electronic packaging (01.01.2019)

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Journal Article

Wafer-level 3D integration technology

Wafer-level 3D integration technology

by Koester, S. J., Young, A. M., Yu, R. R., Purushothaman, S., Chen, K.-N., La Tulipe, D. C., Rana, N., Shi, L., Wordeman, M. R., Sprogis, E. J.
Published in IBM journal of research and development (01.11.2008)

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Journal Article

Wafer scale bonded active photonics interposer

Wafer scale bonded active photonics interposer

by Leake, Gerald, Coolbaugh, Douglas, La Tulipe, Douglas
Year of Publication 12.12.2023

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Patent

Wafer scale bonded active photonics interposer

Wafer scale bonded active photonics interposer

by Leake, Gerald, Coolbaugh, Douglas, La Tulipe, Douglas
Year of Publication 06.09.2022

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Patent

Fundamental study of IMC grains at low anneal temperature

Fundamental study of IMC grains at low anneal temperature

by Gerets, Carine, Derakhshandeh, Jaber, Shafahian, Ehsan, Cochet, Tom, Charles La Tulipe, Douglas, Beyer, Gerald, Miller, Andy, Beyne, Eric
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)

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Conference Proceeding

AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING SAID STRUCTURE

AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING SAID STRUCTURE

by La Tulipe, Douglas Charles, Hiblot, Gaspard, Jourdain, Anne
Year of Publication 31.05.2023

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Patent

Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

by Derakhshandeh, Jaber, Beyne, Eric, Beyer, Gerald, Capuz, Giovanni, Cherman, Vladimir, De Preter, Inge, Gerets, Carine, Shafahian, Ehsan, Kennes, Koen, Jamieson, Geraldine, Cochet, Tom, Webers, Tomas, Tobback, Bert, Van der Plas, Geert, La Tulipe, Douglas Charles, Phommahaxay, Alain, Miller, Andy
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)

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Conference Proceeding

METHOD FOR PRODUCING A THROUGH SEMICONDUCTOR VIA CONNECTION

METHOD FOR PRODUCING A THROUGH SEMICONDUCTOR VIA CONNECTION

by La Tulipe, Douglas Charles, Hiblot, Gaspard, Jourdain, Anne
Year of Publication 25.08.2022

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Patent

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

by Suhard, Samuel, Kennes, Koen, Bex, Pieter, Jourdain, Anne, Teugels, Lieve, Walsby, Edward, Bolton, Chris, Patel, Jash, Ashraf, Huma, Barnett, Richard, Fodor, Ferenc, Phommahaxay, Alain, La Tulipe, Douglas, Beyer, Gerald, Beyne, Eric
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

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Conference Proceeding

Wafer scale bonded active photonics interposer

Wafer scale bonded active photonics interposer

by Leake, Gerald, Coolbaugh, Douglas, La Tulipe, Douglas
Year of Publication 30.06.2020

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Patent

Confined IMCs for low temperature and high throughput D2W bonding

Confined IMCs for low temperature and high throughput D2W bonding

by Derakhshandeh, Jaber, La Tulipe, Douglas Charles, Capuz, Giovanni, Cherman, Vladimir, Gerets, Carine, Cochet, Tom, Shafahian, Ehsan, Preter, Inge De, Jamieson, Geraldine, Webers, Tomas, Beyne, Eric, Beyer, Gerald, Miller, Andy
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)

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Conference Proceeding

Two-stage expanded beam optical coupling

Two-stage expanded beam optical coupling

by Van Campenhout, Joris, Kim, Do Won, La Tulipe, Douglas Charles, Van Steenberge, Geert, Missinne, Jeroen, He, Junwen, Yilmaz, Yigit
Year of Publication 30.01.2024

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Patent

Photonics optoelectrical system

Photonics optoelectrical system

by Leake, Jr., Gerald L, Charles, William, Coolbaugh, Douglas, La Tulipe, Douglas
Year of Publication 10.01.2023

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Patent

Heterogeneous structure on an integrated photonics platform

Heterogeneous structure on an integrated photonics platform

by Morton, Paul A, Coolbaugh, Douglas, La Tulipe, Douglas, Usechak, Nicholas G
Year of Publication 10.01.2023

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Patent

A PHOTONIC INTEGRATED CHIP ASSEMBLY COMPRISING A PACKAGE SUBSTRATE WITH A LIGHT CONDUCTIVE STRUCTURE

A PHOTONIC INTEGRATED CHIP ASSEMBLY COMPRISING A PACKAGE SUBSTRATE WITH A LIGHT CONDUCTIVE STRUCTURE

by Van Campenhout, Joris, La Tulipe, Douglas Charles, Van Steenberge, Geert, Podpod, Arnita, He, Junwen, El Amrani, Abderrahim, Kumar, Saurav
Year of Publication 14.06.2023

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Patent

$A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10\mu \mathrm pitch microbumps$

A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10\mu \mathrm pitch microbumps

by Derakhshandeh, Jaber, Gerets, Carine, Inoue, Fumihiro, Capuz, Giovanni, Cherman, Vladimir, Lofrano, Melina, Hou, Lin, Cochet, Tom, De Preter, Inge, Webers, Tomas, Bex, Pieter, Jamieson, Geraldine, Maehara, Masataka, Shafahian, Ehsan, Bertheau, Julien, Beyne, Eric, La Tulipe, Douglas Charles, Beyer, Gerald, Van der Plas, Geert, Miller, Andy
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

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Conference Proceeding

TWO-STAGE EXPANDED BEAM OPTICAL COUPLING

TWO-STAGE EXPANDED BEAM OPTICAL COUPLING

by Van Campenhout, Joris, Kim, Do Won, La Tulipe, Douglas Charles, Van Steenberge, Geert, Missinne, Jeroen, He, Junwen, Yilmaz, Yigit
Year of Publication 12.05.2022

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Patent

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