Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip–chip interconnection
Yim, Myung Jin, Kwon, Woonseong, Paik, Kyung Wook
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.01.2006)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.01.2006)
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Journal Article
Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications
Myung Jin Yim, Myung Jin Yim, In Ho Jeong, In Ho Jeong, Hyung-Kyu Choi, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Sang Hwang, Jin-Yong Ahn, Jin-Yong Ahn, Woonseong Kwon, Woonseong Kwon, Kyung-Wook Paik, Kyung-Wook Paik
Published in IEEE transactions on components and packaging technologies (01.12.2005)
Published in IEEE transactions on components and packaging technologies (01.12.2005)
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Journal Article
Fine pitch chip interconnection technology for 3D integration
Jihwan Hwang, Jongyeon Kim, Woonseong Kwon, Unbyoung Kang, Taeje Cho, Sayoon Kang
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
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Conference Proceeding
Novel thinning/backside passivation for substrate coupling depression of 3D IC
Woonseong Kwon, Jaesik Lee, Lee, V., Seetoh, J., Yenchen Yeo, YeeMong Khoo, Ranganathan, N., Keng Hwa Teo, Shan Gao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications
Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim, Hyoung-Joon Kim, Woonseong Kwon, Kyung Woon Jang, Kyung Wook Paik
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications
Myung-Jin Yim, In ho Jung, Hyung-Kyu Choi, Kijoong Kim, Jia-Sang Hwang, Jin-Yong Ahn, Woonseong Kwon, Kyung Wook Paik
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
PACKAGE STIFFENER FOR PROTECTING SEMICONDUCTOR DIE
Tuttle, Erick, Li, Yuan, Edwards, William, Iyengar, Madhusudan Krishnan, Padilla, Jorge, Kwon, Woonseong, Kang, TeckGyu
Year of Publication 01.08.2019
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Year of Publication 01.08.2019
Patent
Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers
KIM TAEEUN, CHO TAEJE, LEE CHIYOUNG, LEE HYUEKJAE, KWON WOONSEONG, KWON YONGHWAN, KIM JUNG-HWAN
Year of Publication 19.03.2013
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Year of Publication 19.03.2013
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Semiconductor package and method of manufacturing the same
Kim, Jung-Hwan, Kang, Un-Byoung, Yi, Dong-Hun, Kwon, Woonseong, Jang, Hyung-Sun, Jeon, Jongkeun, Lee, Yongjin, Kim, Keeseok
Year of Publication 28.02.2012
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Year of Publication 28.02.2012
Patent
Semiconductor package and method of manufacturing the same
JANG HYUNG-SUN, LEE YONGJIN, KANG UN-BYOUNG, KIM KEESEOK, JEON JONGKEUN, KWON WOONSEONG, KIM JUNG-HWAN, YI DONG-HUN
Year of Publication 28.02.2012
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Year of Publication 28.02.2012
Patent
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
JANG HYUNG-SUN, LEE YONGJIN, KANG UN-BYOUNG, KIM KEESEOK, JEON JONGKEUN, KWON WOONSEONG, KIM JUNG-HWAN, YI DONG-HUN
Year of Publication 13.05.2010
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Year of Publication 13.05.2010
Patent