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INTEGRATED CIRCUIT PACKAGE, SYSTEM COMPRISING PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, METHOD OF SOLDERING INTEGRATED CIRCUIT PACKAGE TO PRINTED CIRCUIT BOARD
by
OCAMPO, Adrian
,
TU, Benson
,
WANG, Zhiyang
,
KWOK
,
Bianca
Year of Publication
25.07.2024
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PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A SEATING PLANE OF AT LEAST 6 MILS
by
Wang, Zhiyang
,
Tu, Benson
,
Kwok
,
Bianca
,
Ocampo, Adrian
Year of Publication
18.07.2024
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Patent
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chemistry
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medicine
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sciences
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casings or constructional details of electric apparatus
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electric techniques not otherwise provided for
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electricity
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manufacture of assemblages of electrical components
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printed circuits
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esp@cenet
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