Granular bond number model to predict the flow of fine flour powders using particle properties
Siliveru, K., Jange, C.G., Kwek, J.W., Ambrose, R.P.K.
Published in Journal of food engineering (01.09.2017)
Published in Journal of food engineering (01.09.2017)
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Journal Article
A pilot scale study on the fluidized bed binderless granulation of a humidified type C hygroscopic pharmaceutical material
Kwek, J.W., Lim, M.W., Shen, S.C., Ng, W.K., Tan, Reginald B.H.
Published in Powder technology (01.03.2012)
Published in Powder technology (01.03.2012)
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Journal Article
High speed imaging with electrostatic charge monitoring to track powder deagglomeration upon impact
Kwek, J.W., Heng, Desmond, Lee, S.H., Ng, W.K., Chan, H.-K., Adi, S., Heng, Jerry, Tan, Reginald B.H.
Published in Journal of aerosol science (01.11.2013)
Published in Journal of aerosol science (01.11.2013)
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Journal Article