Negative-bias temperature instability cure by process optimization
Scarpa, A., Ward, D., Dubois, J., van Marwijk, L., Gausepohl, S., Campos, R., Kwang Ye Sim, Cacciato, A., Kho, R., Bolt, M.
Published in IEEE transactions on electron devices (01.06.2006)
Published in IEEE transactions on electron devices (01.06.2006)
Get full text
Journal Article
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects
Tan, Cher Ming, Roy, Arijit, Tan, Kok Tong, Ye, Derek Sim Kwang, Low, Frankie
Published in Microelectronics and reliability (01.09.2005)
Published in Microelectronics and reliability (01.09.2005)
Get full text
Journal Article
Conference Proceeding