Solution-processed SnO2 thin film for a hysteresis-free planar perovskite solar cell with a power conversion efficiency of 19.2
Jung, Kwang-Ho, Seo, Ja-Young, Lee, Seonhee, Shin, Hyunjung, Park, Nam-Gyu
Published in Journal of materials chemistry. A, Materials for energy and sustainability (2017)
Published in Journal of materials chemistry. A, Materials for energy and sustainability (2017)
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Journal Article
Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package
Jeong, Haksan, Jung, Kwang-Ho, Lee, Choong-Jae, Min, Kyung Deuk, Myung, Woo-Ram, Jung, Seung-Boo
Published in Journal of materials science. Materials in electronics (01.05.2020)
Published in Journal of materials science. Materials in electronics (01.05.2020)
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Journal Article
Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications
Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Jeong, Haksan, Jung, Seung-Boo
Published in Journal of materials science. Materials in electronics (01.10.2019)
Published in Journal of materials science. Materials in electronics (01.10.2019)
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Journal Article
Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns
Jung, Kwang-Ho, Jeong, Haksan, Lee, Choong-Jae, Min, Kyung Deuk, Jung, Seung-Boo
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
RF characteristics of flexible circuits patterned with hybrid Ag paste
Jung, Kwang-Ho, Kim, Sang-Woo, Maeng, Min-Kyung, Kam, Dong Gun, Jung, Seung-Boo
Published in Journal of materials science. Materials in electronics (01.03.2018)
Published in Journal of materials science. Materials in electronics (01.03.2018)
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Journal Article
Adhesion of PDMS substrates assisted by Plasma Graft Polymerization
Jung, Kwang-Ho, Kim, Dae Gon, Jung, Seung-Boo
Published in Surface and interface analysis (01.07.2016)
Published in Surface and interface analysis (01.07.2016)
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Journal Article
Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility
Park, Bum-Geun, Jung, Kwang-Ho, Jung, Seung-Boo
Published in Journal of alloys and compounds (30.03.2017)
Published in Journal of alloys and compounds (30.03.2017)
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Journal Article
Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics
Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Jung, Kwang-Ho, Jung, Seung-Boo
Published in Journal of alloys and compounds (25.07.2019)
Published in Journal of alloys and compounds (25.07.2019)
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Journal Article
Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy
Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Jeong, Haksan, Kim, Jae-Ha, Jung, Seung-Boo
Published in Advanced engineering materials (01.12.2020)
Published in Advanced engineering materials (01.12.2020)
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Journal Article
Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering
Lee, Choong-Jae, Jung, Kwang-Ho, Min, Kyung Deuk, Park, Bum-Geun, Jung, Seung-Boo
Published in Journal of materials science & technology (15.09.2020)
Published in Journal of materials science & technology (15.09.2020)
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Journal Article
Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy
Jung, Kwang-Ho, Kim, Jungsoo, Park, Bum-Geun, Lee, Choong-Jae, Sung, Hwan-Jin, Jung, Seung-Boo
Published in Journal of alloys and compounds (05.06.2018)
Published in Journal of alloys and compounds (05.06.2018)
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Journal Article