High reliable and environmental friendly molding compound for CABGA(R) packages
Byung-Seon Kong, Hyo-Chang Yun, Jong-Chan Lim, Yeon-Su Jung, Dong-Young Kim, Kwan-Seek Chung
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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