Characteristics of ALD Tungsten Nitride Using B2H6, WF6, and NH3 and Application to Contact Barrier Layer for DRAM
Kim, Soo-Hyun, Kim, Jun-Ki, Lee, Ju Hee, Kwak, Nohjung, Kim, Jinwoong, Jung, Sung-Hoon, Hong, Mi-Ran, Lee, Sang Hyeob, Collins, Josh, Sohn, Hyunchul
Published in Journal of the Electrochemical Society (2007)
Published in Journal of the Electrochemical Society (2007)
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Journal Article
Characteristics of Cobalt Films Deposited by Metal Organic Chemical Vapor Deposition Method Using Dicobalt Hexacarbonyl tert-Butylacetylene
Lee, Keunwoo, Park, Taeyong, Lee, Jaesang, Kim, Jinwoo, Kim, Jeongtae, Kwak, Nohjung, Yeom, Seungjin, Jeon, Hyeongtag
Published in Japanese Journal of Applied Physics (01.07.2008)
Published in Japanese Journal of Applied Physics (01.07.2008)
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Journal Article
Accelerated corrosion and oxidation of tungsten plug during tungsten CMP
Kyungho Hwang, Keejoon Oh, Hyunghwan Kim, Nohjung Kwak
Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
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Published in 2015 International Conference on Planarization/CMP Technology (ICPT) (01.09.2015)
Conference Proceeding
Atomic Layer Deposition of Low-Resistivity and High-Density Tungsten Nitride Thin Films Using B2H6, WF6, and NH3
Kim, Soo-Hyun, Kim, Jun-Ki, Kwak, Nohjung, Sohn, Hyunchul, Kim, Jinwoong, Jung, Sung-Hoon, Hong, NE-Ran, Lee, Sang Hyeob, Coffins, Josh
Published in Electrochemical and solid-state letters (01.01.2006)
Published in Electrochemical and solid-state letters (01.01.2006)
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Journal Article
Atomic Layer Deposition of Low-Resistivity and High-Density Tungsten Nitride Thin Films Using B[sub 2]H[sub 6], WF[sub 6], and NH[sub 3]
Kim, Soo-Hyun, Kim, Jun-Ki, Kwak, Nohjung, Sohn, Hyunchul, Kim, Jinwoong, Jung, Sung-Hoon, Hong, Mi-Ran, Lee, Sang Hyeob, Collins, Josh
Published in Electrochemical and solid-state letters (2006)
Published in Electrochemical and solid-state letters (2006)
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Journal Article
BEOL process integrations with Cu/FSG wiring at 90 nm design-rule DDR DRAM and their effects on yield, refresh time, and wafer-level reliability
Nohiung Kwak, Sang-Tae Ahn, Hyung-Soon Park, Seo-Min Kim, Jin-Ki Jung, Gyu-Hyun Kim, Geun-Young Choi, Dong-Chul Koo, Tae-Oh Jung, Ja-Chun Ku, Jae-Kwan Jung, Jinwoong Kim, Sungwook Park, Hyunchul Sohn, Soo-Hyun Kim
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding