Micro via and line patterning for PCB using imprint technique
Ra, Seunghyun, Lee, Choonkeun, Cho, Jaechoon, Lee, Sangmoon, Lee, Jungwoo, Hong, Myungho, Kwak, Jungbok
Published in Current applied physics (01.10.2008)
Published in Current applied physics (01.10.2008)
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Journal Article
Thermal Imprint Lithography onto Filler Incorporated Composite Resin
Lee, Sangmoon, Kwak, Jungbok, Oh, Yongsoo, Lee, Hwan-Soo
Published in Japanese Journal of Applied Physics (01.06.2009)
Published in Japanese Journal of Applied Physics (01.06.2009)
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Journal Article