Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding
Kuziora, Stéphane Léonard, Nguyen, Hoang-Vu, Aasmundtveit, Knut Eilif
Published in Journal of electronic materials (01.02.2023)
Published in Journal of electronic materials (01.02.2023)
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Journal Article
Ag–(In–Bi) solid-state bonding
Kuziora, Stéphane Léonard, Nguyen, Hoang-Vu, Aasmundtveit, Knut Eilif
Published in Journal of materials science. Materials in electronics (01.06.2023)
Published in Journal of materials science. Materials in electronics (01.06.2023)
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Journal Article
Bi Behaviour in Au-(In-Bi) SLID Bonding
Kuziora, Stephane Leonard, Nguyen, Hoang-Vu, Bolstad, Per Kristian, Aasmundtveit, Knut E.
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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