Search Results - "Kuwabara, Haruyoshi" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

A Comparative Study of the Hydroxyl and Saponification Values of Polysorbate 60 in International Food Additive Specifications

A Comparative Study of the Hydroxyl and Saponification Values of Polysorbate 60 in International Food Additive Specifications

by Wakita, Kazuaki, Kuwabara, Haruyoshi, Furusho, Noriko, Tatebe, Chiye, Sato, Kyoko, Akiyama, Hiroshi
Published in American journal of analytical chemistry (2014)

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Journal Article

Electronic Spectra of Cyclotrisilane (Si3) and Disilene (Si=Si) Frameworks

Electronic Spectra of Cyclotrisilane (Si3) and Disilene (Si=Si) Frameworks

by Watanabe, Hamao, Kougo, Yuichi, Kato, Motohiko, Kuwabara, Haruyoshi, Okawa, Tadashi, Nagai, Yoichiro
Published in Bulletin of the Chemical Society of Japan (01.01.1984)

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Journal Article

LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND FLIP-CHIP SEMICONDUCTOR DEVICE SEALED WITH THE SAME AS UNDERFILL MATERIAL

LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND FLIP-CHIP SEMICONDUCTOR DEVICE SEALED WITH THE SAME AS UNDERFILL MATERIAL

by KUWABARA HARUYOSHI
Year of Publication 24.09.2010

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Patent

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND FLIP CHIP SEMICONDUCTOR DEVICE USING CURED PRODUCT OF THE SAME AS UNDERFILL MATERIAL

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND FLIP CHIP SEMICONDUCTOR DEVICE USING CURED PRODUCT OF THE SAME AS UNDERFILL MATERIAL

by KUWABARA HARUYOSHI
Year of Publication 20.05.2010

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Patent

MEASURING METHOD FOR MEASURING REPAIRABILITY AND REWORKABILITY OF SEMICONDUCTOR PACKAGE, AND MEASURING DEVICE FOR THE SAME

MEASURING METHOD FOR MEASURING REPAIRABILITY AND REWORKABILITY OF SEMICONDUCTOR PACKAGE, AND MEASURING DEVICE FOR THE SAME

by KUWABARA HARUYOSHI
Year of Publication 30.04.2010

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Patent

LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR HAVING CONTROLLED FLOWABILITY

LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR HAVING CONTROLLED FLOWABILITY

by KUWABARA HARUYOSHI
Year of Publication 20.08.2009

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Patent

FLAME-RETARDANT SIDEFILL MATERIAL FOR MOUNTING AND SEMICONDUCTOR DEVICE

FLAME-RETARDANT SIDEFILL MATERIAL FOR MOUNTING AND SEMICONDUCTOR DEVICE

by KUWABARA HARUYOSHI
Year of Publication 15.01.2009

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Patent

SEALING MATERIAL FOR MOUNTING AND SEMICONDUCTOR DEVICE

SEALING MATERIAL FOR MOUNTING AND SEMICONDUCTOR DEVICE

by KUWABARA HARUYOSHI
Year of Publication 31.07.2008

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Patent

HEAT-CURABLE AND ULTRAVIOLET-CURABLE EPOXY RESIN COMPOSITION AND SEALING MATERIAL COMPOSED OF CURED PRODUCT THEREOF

HEAT-CURABLE AND ULTRAVIOLET-CURABLE EPOXY RESIN COMPOSITION AND SEALING MATERIAL COMPOSED OF CURED PRODUCT THEREOF

by KUWABARA HARUYOSHI
Year of Publication 22.05.2008

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Patent

THIXOTROPIC SEALANT

THIXOTROPIC SEALANT

by KUWABARA HARUYOSHI
Year of Publication 24.04.2008

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Patent

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

by KUWABARA HARUYOSHI
Year of Publication 17.04.2008

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Patent

END SEALING MATERIAL

END SEALING MATERIAL

by KUWABARA HARUYOSHI
Year of Publication 01.11.2007

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Patent

ULTRAVIOLET-CURING TYPE END SEALING MATERIAL

ULTRAVIOLET-CURING TYPE END SEALING MATERIAL

by KUWABARA HARUYOSHI
Year of Publication 01.11.2007

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Patent

CARBON PASTE, LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

CARBON PASTE, LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

by KUWABARA HARUYOSHI
Year of Publication 26.07.2007

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Patent

METHOD FOR PRODUCING ENCAPSULATING MATERIAL FOR COB MOUNTING

METHOD FOR PRODUCING ENCAPSULATING MATERIAL FOR COB MOUNTING

by KUWABARA HARUYOSHI
Year of Publication 09.11.2006

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Patent

HEAT-RESISTANT AND ULTRAVIOLET-CURABLE RESIN COMPOSITION

HEAT-RESISTANT AND ULTRAVIOLET-CURABLE RESIN COMPOSITION

by KUWABARA HARUYOSHI
Year of Publication 22.06.2006

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Patent

LIQUID EPOXY RESIN COMPOSITION, LIGHT-SHIELDING MATERIAL COMPOSED OF CURED PRODUCT OF COMPOSITION, AND SEMICONDUCTOR DEVICE SEALED WITH CURED PRODUCT

LIQUID EPOXY RESIN COMPOSITION, LIGHT-SHIELDING MATERIAL COMPOSED OF CURED PRODUCT OF COMPOSITION, AND SEMICONDUCTOR DEVICE SEALED WITH CURED PRODUCT

by KUWABARA HARUYOSHI
Year of Publication 02.02.2006

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Patent

ULTRAVIOLET-CURABLE EPOXY RESIN COMPOSITION AND SEALING MATERIAL COMPOSED OF CURED PRODUCT THEREOF

ULTRAVIOLET-CURABLE EPOXY RESIN COMPOSITION AND SEALING MATERIAL COMPOSED OF CURED PRODUCT THEREOF

by KUWABARA HARUYOSHI
Year of Publication 02.02.2006

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Patent

HEAT-RESISTANT ULTRAVIOLET-CURING TYPE RESIN COMPOSITION

HEAT-RESISTANT ULTRAVIOLET-CURING TYPE RESIN COMPOSITION

by KUWABARA HARUYOSHI
Year of Publication 30.06.2005

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Patent

SIDE FILLING MATERIAL FOR FLIP CHIP MOUNTING, AND SEMICONDUCTOR DEVICE

SIDE FILLING MATERIAL FOR FLIP CHIP MOUNTING, AND SEMICONDUCTOR DEVICE

by KUWABARA HARUYOSHI
Year of Publication 21.04.2005

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Patent

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