Diffusion studies of copper on ruthenium thin film a plateable copper diffusion barrier
Chan, R, Arunagiri, T N, Zhang, Y, Chyan, O, Wallace, R M, Kim, M J, Kur, T Q
Published in Electrochemical and solid-state letters (01.01.2004)
Published in Electrochemical and solid-state letters (01.01.2004)
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